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Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections

  • US 6,165,890 A
  • Filed: 01/21/1998
  • Issued: 12/26/2000
  • Est. Priority Date: 01/21/1997
  • Status: Expired due to Term
First Claim
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1. A method of forming an air gap within a semiconductor structure comprising the steps of:

  • using a sacrificial material to occupy a closed interior volume in a semiconductor structure;

    causing the sacrificial material to decompose into one or more gaseous decomposition products; and

    removing at least one of the one or more gaseous decomposition products by passage through at least one solid layer contiguous to the interior volume; and

    wherein the decomposition of the sacrificial material leaves an air gap at the closed interior volume previously occupied thereby, and the sacrificial material comprises a norbornene-type polymer.

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