Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
First Claim
1. A method of forming an air gap within a semiconductor structure comprising the steps of:
- using a sacrificial material to occupy a closed interior volume in a semiconductor structure;
causing the sacrificial material to decompose into one or more gaseous decomposition products; and
removing at least one of the one or more gaseous decomposition products by passage through at least one solid layer contiguous to the interior volume; and
wherein the decomposition of the sacrificial material leaves an air gap at the closed interior volume previously occupied thereby, and the sacrificial material comprises a norbornene-type polymer.
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Abstract
A method of forming an air gap or gaps within solid structures and specifically semiconductor structures to reduce capacitive coupling between electrical elements such as metal lines, wherein a norbornene-type polymer is used as a sacrificial material to occupy a closed interior volume in a semiconductor structure. The sacrificial material is caused to decompose into one or more gaseous decomposition products which are removed, preferably by diffusion, through an overcoat layer. The decomposition of the sacrificial material leaves an air gap or gaps at the closed interior volume previously occupied by the norbornene-type polymer. The air gaps may be disposed between electrical leads to minimize capacitive coupling therebetween.
258 Citations
39 Claims
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1. A method of forming an air gap within a semiconductor structure comprising the steps of:
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using a sacrificial material to occupy a closed interior volume in a semiconductor structure; causing the sacrificial material to decompose into one or more gaseous decomposition products; and removing at least one of the one or more gaseous decomposition products by passage through at least one solid layer contiguous to the interior volume; and wherein the decomposition of the sacrificial material leaves an air gap at the closed interior volume previously occupied thereby, and the sacrificial material comprises a norbornene-type polymer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of forming one or more air gaps in a semiconductor structure comprising the steps of:
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forming a patterned layer of sacrificial material on a substrate corresponding to a pattern of one or more gaps to be formed in the semiconductor structure; depositing a second material on the substrate within regions bordered by the sacrificial material; forming an overcoat layer of material overlying the patterned layer of sacrificial material and second material in the regions bordered by the sacrificial material; causing the sacrificial material to decompose into one or more gaseous decomposition products; and removing at least one of the one or more gaseous decomposition products by passage through the overcoat layer so that one or more air gaps are formed within the semiconductor structure. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A method of forming an air gap within a structure comprising the steps of:
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using a sacrificial material to occupy a closed interior volume in the structure; heating the sacrificial material to cause it to decompose into one or more gaseous decomposition products; and removing at least one of the one or more gaseous decomposition products by passage through at least one solid layer contiguous to the interior volume; and wherein the decomposition of the sacrificial material leaves an air gap at the closed interior volume previously occupied by the sacrificial material. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification