Integrated circuit having embedded memory with electromagnetic shield
First Claim
Patent Images
1. An integrated circuit comprising:
- a substrate having a memory area and a non-memory area;
a voltage supply conductor;
an embedded memory fabricated on the substrate within the memory area;
at least one memory routing layer, which includes a highest memory routing layer relative to the substrate, fabricated within the memory area and electrically coupled to the embedded memory;
first and second semiconductor cells fabricated on the substrate within the non-memory area;
an electromagnetic shield fabricated as an additional, non-routing layer on the integrated circuit over the highest memory routing layer and covering substantially the entire memory area, wherein the electromagnetic shield is electrically coupled to the voltage supply conductor;
a logic routing layer, which is the next-higher routing layer on the integrated circuit above the highest memory routing layer and is fabricated over the memory and non-memory areas and over the electromagnetic shield; and
a signal wire electrically coupled between the first and second semiconductor cells and having a first conductive segment routed within the logic routing layer and extending over the memory area.
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Abstract
An integrated circuit including a substrate having a memory area and a non-memory area. An embedded memory is fabricated on the substrate within the memory area. First and second semiconductor cells are fabricated on the substrate within the non-memory area. An electromagnetic shield covers substantially memory area. A routing layer is fabricated over the memory and non-memory areas and over the electromagnetic shield. A signal wire is electrically coupled between the first and second semiconductor cells and has a conductive segment which is routed within the routing layer and extends over the memory area.
64 Citations
14 Claims
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1. An integrated circuit comprising:
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a substrate having a memory area and a non-memory area; a voltage supply conductor; an embedded memory fabricated on the substrate within the memory area; at least one memory routing layer, which includes a highest memory routing layer relative to the substrate, fabricated within the memory area and electrically coupled to the embedded memory; first and second semiconductor cells fabricated on the substrate within the non-memory area; an electromagnetic shield fabricated as an additional, non-routing layer on the integrated circuit over the highest memory routing layer and covering substantially the entire memory area, wherein the electromagnetic shield is electrically coupled to the voltage supply conductor; a logic routing layer, which is the next-higher routing layer on the integrated circuit above the highest memory routing layer and is fabricated over the memory and non-memory areas and over the electromagnetic shield; and a signal wire electrically coupled between the first and second semiconductor cells and having a first conductive segment routed within the logic routing layer and extending over the memory area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An integrated circuit comprising:
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a substrate having a memory area and a non-memory area; an embedded memory fabricated on the substrate within the memory area; first and second semiconductor cells fabricated on the substrate within the non-memory area; a voltage supply conductor; first, second and third routing layers which are applied over the substrate and are separated from one another by first and second dielectric layers, respectively, wherein the first and second routing layers comprise a plurality of bit lines within the memory area which are electrically coupled to the embedded memory, the second routing layer is a highest memory routing layer relative to the substrate, the third routing layer comprises a signal line which electrically couples the first semiconductor cell to the second semiconductor cell and extends over the memory area, and the third routing layer is the next-higher routing layer on the integrated circuit above the second routing layer and is separated from the second routing layer by the second dielectric layer; and means for shielding the bit lines within the memory area from an electromagnetic field generated by the signal wire over the memory area, wherein the means for shielding is electrically coupled to the voltage supply conductor.
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14. An integrated circuit comprising:
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a substrate having a memory area and a non-memory area; a voltage supply conductor; an embedded memory fabricated on the substrate within the memory area; at least one memory routing layer, which includes a highest memory routing layer relative to the substrate, fabricated within the memory area and electrically coupled to the embedded memory; first and second semiconductor cells fabricated on the substrate within the non-memory area; an electromagnetic shield fabricated as an additional, non-routing layer on the integrated circuit over the highest memory routing layer and covering substantially the entire memory area, wherein the electromagnetic shield is electrically coupled to the voltage supply conductor; a logic routing layer, which is the next-higher routing layer on the integrated circuit above the highest memory routing layer and is fabricated over the memory and non-memory areas and over the electromagnetic shield, wherein the logic routing layer has a thickness and the electromagnetic shield has a thickness which is up to one-half of the thickness of the logic routing layer; and a signal wire electrically coupled between the first and second semiconductor cells and having a first conductive segment routed within the logic routing layer and extending over the memory area.
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Specification