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Substrate for use in wafer attracting apparatus and manufacturing method thereof

  • US 6,166,432 A
  • Filed: 03/02/1998
  • Issued: 12/26/2000
  • Est. Priority Date: 03/06/1997
  • Status: Expired due to Term
First Claim
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1. A substrate for use in a wafer attracting apparatus, said substrate comprises a ceramic material and adapted to attract and hold a wafer onto an attracting surface thereof, wherein said attracting surface comprises a ductile worked surface, the ductile worked surface has concaved portions, a diameter of each of the concave portions is 0.1 μ

  • m or less, and said attracting surface is so non-adherent that when a wafer is attracted onto the attracting surface of the substrate and released from the attracting surface, the number of particles adhering to that wafer is 9.3 or less per 1 cm2.

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