Semiconductor test structure formed in cutting path of semiconductor water
First Claim
1. In a semiconductor test structure of the type formed in a cutting path of a semiconductor substrate wafer, a semiconductor test device comprising:
- at least one group of test cells that are connected in series and looped back so as to form an oscillator, each of the test cells including;
a base cell formed at least partially in the semiconductor substrate, the base cell including a set of terminals; and
an ancillary structure connected to at least one of the terminals of the base cell,wherein the ancillary structure is distributed over at least first and second metallization levels that are above the base cell, and is formed on each of the metallization levels by first and second mutually entangled networks of metal tracks that are electrically arranged so as to form an at least capacitive ancillary structure.
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Accused Products
Abstract
A semiconductor test structure includes a semiconductor test device having at least one group of test cells that are connected in series and looped back so as to form an oscillator. Each test cell includes a base cell that is formed at least partially in the semiconductor substrate and an ancillary structure that is connected to at least one of the terminals of the base cell. Further, the ancillary structure is distributed over at least two metallization levels that are above the base cell, and is formed on each metallization level by first and second mutually entangled networks of metal tracks that are electrically arranged so as to form an at least capacitive ancillary structure.
20 Citations
25 Claims
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1. In a semiconductor test structure of the type formed in a cutting path of a semiconductor substrate wafer, a semiconductor test device comprising:
at least one group of test cells that are connected in series and looped back so as to form an oscillator, each of the test cells including; a base cell formed at least partially in the semiconductor substrate, the base cell including a set of terminals; and an ancillary structure connected to at least one of the terminals of the base cell, wherein the ancillary structure is distributed over at least first and second metallization levels that are above the base cell, and is formed on each of the metallization levels by first and second mutually entangled networks of metal tracks that are electrically arranged so as to form an at least capacitive ancillary structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An oscillator comprising a plurality of test cells that are connected in series and looped back, at least one of the test cells comprising:
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a base cell having an input terminal and an output terminal; and an ancillary structure connected to at least one of the input terminal and the output terminal of the base cell, wherein the ancillary structure is distributed over at least first and second metallization levels, and the ancillary structure is formed on each of the metallization levels by first and second mutually entangled networks of metal tracks that are electrically arranged so as to form a capacitive ancillary structure. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor test structure comprising:
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a first test device having at least one oscillator formed solely of base cells; and a second test device having at least one oscillator formed of at least one group of test cells that are connected in series and looped back so as to form an oscillator, each of the test cells including; a base cell formed at least partially in the semiconductor substrate; and an ancillary structure connected to at least one of the terminals of the base cell, wherein the ancillary structure is distributed over at least first and second metallization levels that are above the base cell, and is formed on each of the metallization levels by first and second mutually entangled networks of metal tracks that are electrically arranged so as to form an at least capacitive ancillary structure. - View Dependent Claims (19, 20, 21, 22)
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23. A semiconductor test structure comprising:
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a first test device having at least one oscillator formed solely of base cells; and a second test device having at least one oscillator formed of at least one group of test cells that are connected in series and looped back so as to form an oscillator, each of the test cells including; a base cell formed at least partially in the semiconductor substrate; and an ancillary structure connected to at least one of the terminals of the base cell, wherein the ancillary structure is distributed over at least first and second metallization levels that are above the base cell, and is formed on each of the metallization levels by first and second mutually entangled networks of metal tracks that are electrically arranged so as to form an at least capacitive ancillary structure, on each of the metallization levels, the first network of metal tracks of the ancillary structure is electrically connected to ground, and the ancillary structure includes interconnection vias that successively connect an output terminal of the base cell, the second network of the first metallization level of the ancillary structure, the second network of the second metallization level of the ancillary structure, the second network of a third metallization level of the ancillary structure, and the second network of a fourth metallization level. - View Dependent Claims (24, 25)
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Specification