Monitoring apparatus and method particularly useful in photolithographically processing substrates

• US 6,166,801 A
• Filed: 11/02/1998
• Issued: 12/26/2000
• Est. Priority Date: 07/14/1998
• Status: Expired due to Term

• Current Assignee: Nova Measuring Instruments Limited (Honeywell International Inc.)
• Original Assignee: Nova Measuring Instruments Limited (Honeywell International Inc.)
• Inventors: Dishon, Giora, Finarov, Moshe, Cohen, Yoel, Nirel, Zvi
• Primary Examiner(s): Mathews, Alan A.
• Application Number:
  US09/184,727
• Time in Patent Office: 785 Days
• Field of Search: 355/18, 355/27, 355/53, 396/611, 396/627, 414/935, 414/937, 414/938, 414/939, 414/940, 356/363, 356/358, 356/400, 356/401, 382/145, 430/30
• US Class Current: 355/27
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: G03F 7/70675 Latent image, i.e. measuring the image of the exposed resist prior to development
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling

Abstract

Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.

Claims

1. An apparatus for processing substrates according to a predetermined photolithography process, comprising:

a loading station in which the substrates are loaded from at least one first cassette;

a coating station in which the substrates are coated with a photoresist material;

an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating;

a developing station in which the latent image is developed;

an unloading station in which the substrates are unloaded; and

a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process and before being unloaded in at least one second cassette at said unloading station, said monitoring station comprising;

a supporting plate for receiving substrates to be inspected;

a sealed enclosure having a transparent window aligned with and facing said supporting plate;

said supporting plate being external to said sealed enclosure and spaced from said window thereof;

an optical monitoring system with said sealed enclosure for inspecting substrates on said supporting plate via said transparent window; and

a light source for illuminating the substrates via said optical monitoring system.

2. The apparatus according to claim 1, wherein:

said apparatus further includes a transfer device for transferring said substrates from one station to another;

and said transfer devices also transfers said substrate to said monitoring station.

3. The apparatus according to claim 1, wherein said monitoring station is between said developing station and said unloading station for monitoring the substrates after the substrates have passed through the developing station and before reaching the unloading station.

4. The apparatus according to claim 1, wherein said monitoring station includes an optical monitoring system for detecting overlay registration errors in the alignment of the developed image produced on the substrate in the respective photolithography process with respect to a developed image produced on the substrate in a preceding photolithography process performed on the substrate.

5. The apparatus according to claim 1, wherein said optical monitoring system is configured for detecting defects in the substrate, including defects produced by the photolithography process performed on the substrate.

6. The apparatus according to claim 1, wherein said optical monitoring system is configured for detecting critical dimensional errors in the developed image of the photoresist coating produced during the respective photolithography process.

7. The apparatus according to claim 1, wherein said light source is external to said sealed enclosure and produces a light beam which is applied to said optical system within said sealed enclosure.

8. The apparatus according to claim 1, wherein:

said optical monitoring system within said sealed enclosure includes an optical imaging device;

and said monitoring station further includes an optical image processing unit external to said sealed enclosure and connected to said optical imaging device by electrical conductors passing into said sealed enclosure.

9. The apparatus according to claim 1, wherein said monitoring station further includes a central control and processing unit external to said sealed enclosure and connected to said optical monitoring system for controlling said system via electrical conductors passing into said sealed enclosure.

10. The apparatus according to claim 1, wherein said optical monitoring system within said sealed enclosure includes:

a low-magnification channel for aligning said optical monitoring system with respect to a substrate on said supporting plate;

and a high-magnification channel for measuring said predetermined parameters of the photolithography process after the substrate has passed through said developing station and before reaching the unloading station.

11. The apparatus according to claim 10, wherein both said channels are fixed with respect to each other and with respect to said transparent window.

12. The apparatus according to claim 10, wherein said optical monitoring system within said sealed enclosure further includes an optical head movable within said sealed enclosure and containing an objective lens for said low-magnification channel, and an objective lens for said high-magnification channel.

13. The apparatus according to claim 12, wherein, said lenses are movable together upon moving said optical head.

14. The apparatus according to claim 13, wherein the objective lens of said low-magnification channel has a relatively small numerical aperture, and the objective lens of said high-magnification channel has a relatively large numerical aperture.

15. The apparatus according to claim 14, wherein said high-magnification channel further includes a measuring device within the optical head for accurately measuring the angle of incidence of the light source with respect to the surface of the substrate in the monitoring station.

16. The apparatus according to claim 15, wherein said measuring device comprises:

an identical mirror and an identical lens on each side of the objective lens of the high-magnification channel;

an LED illuminator on one side of the latter objective lens for projecting light through the lens and mirror on the respective side of objective lens onto the substrate, and then through the lens and mirror on the opposite side of the objective lens;

and a position sensor on said opposite side of said latter objective lens.

17. The apparatus according to claim 10, wherein each of said channels includes a shutter between the light source and the channel, said shutters being selectively opened and closed to selectively enable one of said channels.

18. The apparatus according to claim 10, wherein said optical monitoring system within said sealed enclosure includes a calibrating unit which simulates a measuring position for the optical head when the optical head is located in alignment with the calibration unit.

19. The apparatus according to claim 18, wherein said calibration unit includes a target of a high contrast material, a glass plate, and a mirror.

20. The apparatus according to claim 12, wherein said low-magnification channel includes light sources, and a ring light illuminated by said light sources to produce a light cone on the substrate surface with an opening angle larger than 2°

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