Electronic power module, and electronic power system comprising a plurality of said modules
First Claim
1. An electronic power module comprising electronic power components (1) each having at least one contact face (2), control connections (4) for connecting the components to a control module, power connections (5) for conveying power between the components and/or other modules, and at least one metal heat exchanger (6) for removing power dissipated by the Joule effect in said electronic power components (1), characterized in that the contact faces (2) of said electronic power components (1) are mounted directly on the metal heat exchanger (6), the metal heat exchanger (6) being at the same potential as the contact faces (2) of the electronic power components (1), where said same potential is a high voltage above a ground potential.
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Accused Products
Abstract
The invention relates to an electronic power module comprising electronic power components (1) each having at least one contact face (2), control connections (4) for connecting the components to a control module, power connections (5) for conveying power between the components and/or other modules, and at least one metal heat exchanger (6) for removing power dissipated by the Joule effect in the electronic power components (1). According to the invention the contact faces (2) of the electronic power components (1) are mounted directly on the metal heat exchanger (6), the metal heat exchanger (6) being at the same potential as the contact faces (2) of the electronic power components (1).
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Citations
22 Claims
- 1. An electronic power module comprising electronic power components (1) each having at least one contact face (2), control connections (4) for connecting the components to a control module, power connections (5) for conveying power between the components and/or other modules, and at least one metal heat exchanger (6) for removing power dissipated by the Joule effect in said electronic power components (1), characterized in that the contact faces (2) of said electronic power components (1) are mounted directly on the metal heat exchanger (6), the metal heat exchanger (6) being at the same potential as the contact faces (2) of the electronic power components (1), where said same potential is a high voltage above a ground potential.
Specification