Electronic power module, and electronic power system comprising a plurality of said modules

• US 6,166,903 A
• Filed: 06/15/1998
• Issued: 12/26/2000
• Est. Priority Date: 10/16/1996
• Status: Expired due to Fees

• Current Assignee: Alcatel SA (Nokia Corporation)
• Original Assignee: Alcatel SA (Nokia Corporation)
• Inventors: Crouzy, Sophie, Estop, Pascal, Broqua, Nadia, Petitbon, Alain, Ranchy, Eric, Cazabat, Stephane
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US09/077,806
• Time in Patent Office: 925 Days
• Field of Search: 174/16.3, 174/252, 165/80.2, 165/80.4, 165/104.33, 257/714, 361/689-690, 361/699-704, 361/707, 361/710, 361/715, 361/775
• US Class Current: 361/690
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49 of a plurality of wire connectors
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H05K 7/20927 : Liquid coolant without phase change

Abstract

The invention relates to an electronic power module comprising electronic power components (1) each having at least one contact face (2), control connections (4) for connecting the components to a control module, power connections (5) for conveying power between the components and/or other modules, and at least one metal heat exchanger (6) for removing power dissipated by the Joule effect in the electronic power components (1). According to the invention the contact faces (2) of the electronic power components (1) are mounted directly on the metal heat exchanger (6), the metal heat exchanger (6) being at the same potential as the contact faces (2) of the electronic power components (1).

Claims

1. An electronic power module comprising electronic power components (1) each having at least one contact face (2), control connections (4) for connecting the components to a control module, power connections (5) for conveying power between the components and/or other modules, and at least one metal heat exchanger (6) for removing power dissipated by the Joule effect in said electronic power components (1), characterized in that the contact faces (2) of said electronic power components (1) are mounted directly on the metal heat exchanger (6), the metal heat exchanger (6) being at the same potential as the contact faces (2) of the electronic power components (1), where said same potential is a high voltage above a ground potential.

2. An electronic power module according to claim 1, characterized in that the electronic power components (1) and the metal heat exchanger (6) are embedded in a dielectric material (7).

3. An electronic power module according to claim 1 or 2, characterized in that the metal heat exchanger (6) includes passages (8) through which a dielectric heat-conveying fluid flows, said passages (8) being connected via dielectric pipes to a cooler/recycler at ground potential for the dielectric fluid.

4. An electronic power module according to claim 1 or 2, characterized in that the metal heat exchanger (6) is an air-cooled heat exchanger having fins (50) on a face opposite from its face on which the electronic power components (1) are directly bonded, the air flowing between the fins (50).

5. An electronic power module according to claim 4, characterized in that the fins (50) are electrically insulated by a dielectric coating (51) deposited thereon.

6. An electronic power module according to claim 5, characterized in that the coated fins (50) further have a conductive layer (52) deposited on the dielectric coating (51), said conductive layer (52) being put at a given potential.

7. An electronic power module according to claim 1, characterized in that the metal heat exchanger (6) is a heatpipe comprising a hollow metal vaporization chamber having the electronic power components (1) mounted directly on the outside surface thereof, said chamber being at the same potential as the contact faces of the electronic power components (1), and an insulating hollow intermediate portion of dielectric material connecting the hollow metal vaporization chamber to a condensation chamber.

8. An electronic power module according to claim 1, characterized in that the control connections (4) are independent and are electrically insulated from the metal heat exchanger (6).

9. An electronic power module according to claim 8, characterized in that the control connections (4) are connected to a control busbar (9) disposed parallel to the metal heat exchanger (6).

10. An electronic power module according to claim 1, characterized in that each control connection (4) is mounted on the heat exchanger (6) and is electrically insulated from the heat exchanger (6) by a dielectric plate (11).

11. An electronic power module according to claim 1, characterized in that the power connections (5) are connected directly to the metal heat exchanger (6).

12. An electronic power module according to claim 1, characterized in that it comprises both a longitudinal power connection busbar (12) independent from the metal heat exchanger (6) and positioned to one side of the metal heat exchanger (6), and an electrically insulating element (13) interposed between said power connection busbar (12) and said metal heat exchanger (6).

13. An electronic power module according to any one of claim 1, characterized in that it comprises two longitudinal power connection busbars (12) independent of the metal heat exchanger (6) and positioned on either side of the metal heat exchanger (6), an electrically insulating element (13) being interposed between each power connection busbar (12) and the metal heat exchanger (6), the free faces (3) of the electronic power components (1) of the module being connected in alternation to one and the other of the two longitudinal power connection busbars (12).

14. An electronic power module according to claim 12, characterized in that the control connections (14) are integrated on said interposed electrically insulating element (13).

15. An electronic power module according to claim 1, characterized in that the electronic power components are directly mounted between two plates (6, 6'"'"') of a metal heat exchanger, each plate (6, 6'"'"') being at the potential of the contact face (3), each plate (6, 6'"'"') constituting a wall of a heat exchanger.

16. A multi-module electronic power system, characterized in that it comprises a plurality of interconnected electronic power modules according to claim 1.

17. A multi-module electronic power system, characterized in that it comprises a plurality of interconnected electronic power modules according to claim 12, the free side face (12a) of the longitudinal power connection busbar (12) of one module being in mechanical and electrical contact with the side wall (6a) of the metal heat exchanger (6) or with the free side face (12a) of the longitudinal power connection busbar (12) of the preceding module, thereby ensuring that power is conveyed between modules.

18. A modular electronic power system according to claim 17, characterized in that it is fed by two parallel feeds (14, 15) close to each other and separated by a dielectric spacer (16), one of the feeds (14) being disposed in contact with the free side face (6a) of the heat exchanger (6) of one of the end modules, while the other feed (15) has a U-shaped extension (17) and is disposed in contact with the free side face (12a) of the longitudinal power connection busbar (12) of the other end module.

19. A modular electronic power system according to claim 17, characterized in that it further comprises inductor modules (41) each comprising an inductor winding (36) about a ferrite core (37).

20. A multi-module electronic power system, characterized in that it comprises a plurality of electronic power modules according to claim 15, the modules being disposed one on another, being insulated from one another by dielectric spacers (18), each metal plate (6, 6'"'"') of a module co-operating with the facing metal plate (6, 6'"'"') of the following or preceding module to form a passage (8) for flow of the dielectric heat-conveying fluid, the passage (8) for flow of the heat-conveying fluid being interconnected via dielectric manifolds (19).

21. A multi-module electronic power system according to claim 20, characterized in that each plate (6, 6'"'"') projects beyond the dielectric spacers (18) so as to constitute power connections (5).

22. A multi-module electronic power system according to claim 20, characterized in that the control connections (4) are brought to the electronic power components of a module via the inter-plate gap (20) between modules by means of an electrically insulated wire.