Semiconductor integrated circuit card assembly

• US 6,166,911 A
• Filed: 11/20/1997
• Issued: 12/26/2000
• Est. Priority Date: 05/23/1995
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd., Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Original Assignee: Hitachi, Ltd., Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Suzuki, Masakatsu, Mikami, Yoshikatsu, Usami, Mitsuo, Nishi, Kunihiko
• Primary Examiner(s): Gandhi, Jayprakash N.
• Application Number:
  US08/930,057
• Time in Patent Office: 1,132 Days
• Field of Search: 361/737, 361/761, 361/764, 235/380, 235/492, 902/26, 343/895, 257/679
• US Class Current: 361/737
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/49883 the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/12033 : Gunn diode
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board, a casing (5) covering the circuit board, wherein the connecting pads of the conductor circuit and the connecting terminals of the semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent, a neutral plane of the semiconductor chip substantially coinciding with an overall neutral plane of the semiconductor assembly.

Claims

1. A semiconductor assembly, comprising:

a circuit board (1) including a conductor circuit (4);

a semiconductor chip (2) mounted on said circuit board (1); and

a casing (5) covering said circuit board(l);

wherein said conductor circuit (4) and said semiconductor chip (2) are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent (3), a middle part of a thickness of said semiconductor chip (2) coinciding with an overall middle part of a thickness of said semiconductor assembly and wherein said conductor circuit further comprises an antenna circuit (41,

     42) which is formed at least on one surface of said circuit board;

wherein said semiconductor chip has a thickness of no more than 200 μ

m.

2. A semiconductor assembly according to claim 1, wherein said electroconductive bonding agent consists of an anisotropic electroconductive bonding film (31).

3. A semiconductor assembly according to claim 1, wherein said conductor circuit is formed by depositing an electroconductive ink on said circuit board.

4. A semiconductor assembly according to claim 1, wherein said conductor circuit is formed by selectively etching a layer of metallic foil formed on said circuit board.

5. A semiconductor assembly according to claim 1, wherein a spacer (7) consisting of film coated with a bonding agent is attached to a surface of said circuit board, said film being provided with a cut-out (8) for receiving said semiconductor chip therein.

6. A semiconductor assembly according to claim 5, wherein a gap between a peripheral part of said semiconductor chip and a surrounding edge of said cut-out is sufficiently small to avoid any unacceptable surface irregularities from developing in said assembly.

7. A semiconductor assembly according to claim 1, wherein a gap between a peripheral part of said semiconductor chip and a surrounding edge of said cut-out is sufficiently small so that L-K<

2,000 μ

m where L is a dimension of said cut-out and K is a corresponding dimension of said semiconductor chip.

8. A semiconductor assembly according to claim 1, wherein said casing comprises plastic film placed over said circuit board.

9. A semiconductor assembly according to claim 1, wherein said connecting pads of said conductor circuit is attached to an overall opposing surface of said connecting terminals of said semiconductor chip.

10. A semiconductor assembly comprising:

a circuit board including a conductor circuit;

a semiconductor chip mounted on said circuit board; and

a casing covering two sides of said circuit board, wherein said casing includes a polyethylene terephthalate film;

wherein said conductor circuit and said semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent, a middle part of a thickness of said semiconductor chip coinciding with an overall middle part of a thickness of said semiconductor assembly and wherein said conductor circuit further comprises an antenna circuit including at least one antenna coil formed on the surfaces of said circuit board and wherein said at least one antenna coil is covered by the polyethylene terephthalate film of said casing;

wherein said semiconductor chip has a thickness of no more than 200 μ

m.

11. A semiconductor assembly comprising:

a circuit board including a conductor circuit;

a semiconductor chip mounted on said circuit board, wherein said semiconductor chip has a thickness of about 110 μ

m or less;

a casing covering said circuit board; and

wherein said conductor circuit and said semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an anisotropic electroconductive bonding agent, a middle part of a thickness of said semiconductor chip coinciding with an overall middle part of a thickness of said semiconductor assembly and wherein said conductor circuit further comprises an antenna circuit which is formed at least on one surface of said circuit board.