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Semiconductor integrated circuit card assembly

  • US 6,166,911 A
  • Filed: 11/20/1997
  • Issued: 12/26/2000
  • Est. Priority Date: 05/23/1995
  • Status: Expired due to Fees
First Claim
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1. A semiconductor assembly, comprising:

  • a circuit board (1) including a conductor circuit (4);

    a semiconductor chip (2) mounted on said circuit board (1); and

    a casing (5) covering said circuit board(l);

    wherein said conductor circuit (4) and said semiconductor chip (2) are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent (3), a middle part of a thickness of said semiconductor chip (2) coinciding with an overall middle part of a thickness of said semiconductor assembly and wherein said conductor circuit further comprises an antenna circuit (41,

         42) which is formed at least on one surface of said circuit board;

    wherein said semiconductor chip has a thickness of no more than 200 μ

    m.

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