Electronic circuits and circuit boards

• US 6,166,915 A
• Filed: 01/29/1997
• Issued: 12/26/2000
• Est. Priority Date: 01/11/1996
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Mousseau, Joe, Tuttle, Mark E., Lake, Rickie C.
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US08/790,916
• Time in Patent Office: 1,427 Days
• Field of Search: 174/52.1-52.4, 174/250, 174/254, 174/255-258, 174/260, 174/261, 257/678, 257/723, 257/787-790, 257/79, 257/81, 257/99, 257/100, 257/433-437, 264/272.14, 264/272.17, 361/737, 361/749, 361/760, 361/750, 361/748, 361/751, 361/820, 361/792-795, 439/68, 29/829, 29/830, 29/846, 427/510, 427/511, 427/96, 427/504, 438/FOR 369, 438/106, 438/107, 438/110, 438/114, 438/116, 428/901, 428/195, 428/209-220, 250/239
• US Class Current: 361/748
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49883 the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0759 Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base

Abstract

A method of forming a circuit board includes, a) providing a temporary substrate; b) depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate; c) substantially curing the uncured circuit board material into at least one self supporting sheet; d) providing circuit traces atop the cured self supporting sheet; e) mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and f) peeling the temporary substrate and cured self supporting sheet from one another. An electronic circuit of the invention includes, i) a self-supporting electrically insulative ink or paint substrate, the ink or paint substrate having an outer surface; ii) circuit traces provided on the ink or paint substrate outer surface; and iii) at least one electronic circuit component mounted to the ink or paint substrate outer surface in electrical connection with the circuit traces.

Claims

1. An electronic circuit comprising:

a release layer;

an electrically insulative ink substrate on the release layer and having an outer surface;

circuit traces on the ink substrate outer surface; and

at least one electronic circuit component mounted to the ink substrate outer surface in electrical connection with the circuit traces.

2. The electronic circuit of claim 1 further comprising an encapsulating material encapsulating the substrate outer surface, circuit traces and electronic component.

3. The electronic circuit of claim 1 wherein the release layer is a metal foil.

4. The electronic circuit of claim 1 wherein the release layer is polyester.

5. An electronic circuit comprising:

a release layer;

an electrically insulative paint substrate on the release layer and having an outer surface;

circuit traces on the paint substrate outer surface; and

at least one electronic circuit component mounted to the paint substrate outer surface in electrical connection with the circuit traces.

6. The electronic circuit of claim 5 further comprising an encapsulating material encapsulating the substrate outer surface, circuit traces and electronic component.

7. The electronic circuit of claim 5 wherein the release layer is a metal foil.

8. The electronic circuit of claim 5 wherein the release layer is polyester.

9. An electronic circuit comprising:

a release layer;

an electrically insulative ink substrate on the release layer and having an outer surface;

circuit traces on the ink substrate outer surface; and

at least one electronic circuit component mounted to the ink substrate outer surface with conductive epoxy.

10. The electronic circuit of claim 9 wherein the at least one electronic circuit component is in electrical connection with the circuit traces.

11. An electronic circuit comprising:

a release layer;

an electrically insulative ink substrate on the release layer and having an outer surface;

circuit traces on the ink substrate outer surface; and

at least one electronic circuit component mounted to the paint substrate outer surface with conductive epoxy.

12. The electronic circuit of claim 11 wherein the at least one electronic circuit component is in electrical connection with the circuit traces.