Polyolefin composites for printed circuit board and antenna base material

• US 6,168,855 B1
• Filed: 10/15/1999
• Issued: 01/02/2001
• Est. Priority Date: 12/01/1997
• Status: Expired due to Fees

• Current Assignee: Polyeitan Composites Limited
• Original Assignee: Polyeitan Composites Limited
• Inventors: Rein, Dmitry, Vaykhansky, Lev, Cohen, Yachin
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US09/418,443
• Time in Patent Office: 445 Days
• Field of Search: 428/209, 428/297, 428/297.7, 428/298.1, 428/458, 428/901, 174/255, 174/250, 174/258, 174/254, 442/232, 442/378
• US Class Current: 428/209
• CPC Class Codes: B32B 2323/043 HDPE, i.e. high density polyethylene
• CPC Class Codes: B32B 2323/046 LDPE, i.e. low density polyethylene
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/02 in the form of fibres or filaments not used
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C08J 5/04 Reinforcing macromolecular compounds with loose or coherent fibrous material
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/032 consisting of one material
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0158 Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
• CPC Class Codes: H05K 2201/0278 Polymeric fibers
• CPC Class Codes: H05K 2201/0287 Unidirectional or parallel fibers
• CPC Class Codes: H05K 2201/0293 Non-woven fibrous reinforcement
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24628 Nonplanar uniform thickness material
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/249941 Fiber is on the surface of a polymeric matrix having no embedded portion
• CPC Class Codes: Y10T 428/249942 : Fibers are aligned substantially parallel
• CPC Class Codes: Y10T 428/2938 : Coating on discrete and individual rods, strands or filaments
• CPC Class Codes: Y10T 428/31649 : Ester, halide or nitrile of addition polymer
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A polyolefin composite for a printed circuit board or antenna base material, a base material including the composite and electronic modules including the base material. The base material includes at least one dielectric layer including a polyolefin composite and at least one electroconductive layer including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another.

Claims

1. A base material for the production of printed circuit boards and antennas, the base material comprising at least one dielectric layer including a polyolefin composite and at least one electroconductive layer including an electroconductive material, said dielectric and electroconductive layers being intimately bonded to one another.

2. The base material of claim 1, wherein said polyolefin composite is selected from the group consisting of ultrahigh molecular weight polyethylene, high density polyethylene, low density polyethylene, and combinations thereof.

3. The base material of claim 2, wherein said polyolefin composite includes oriented reinforcement components selected from the group consisting of fibers, films, tapes, monofilaments, rods, whiskers and combinations thereof.

4. The base material of claim 3, wherein said oriented reinforcement components selected from said group consisting of fibers, films, tapes, monofilaments, rods, and whiskers are of a form selected from the group consisting of chopped form, continuous form, and combinations thereof.

5. The base material of claim 4, wherein said reinforcement components are distributed in a distribution selected from the group consisting of ordered layers, ordered regions, random distribution, and combinations thereof.

6. The base material of claim 3, wherein said polyolefin composite includes a polyolefin matrix for holding together said reinforcement components.

7. The base material of claim 6, wherein said reinforcement components are selected from the group consisting of ultrahigh molecular weight polyethylene, high density polyethylene, low density polyethylene, and combinations thereof.

8. The base material of claim 6, wherein said polyolefin matrix for holding together said reinforcement components is selected from the group consisting of ultrahigh molecular weight polyethylene, high density polyethylene, low density polyethylene, and combinations thereof, and wherein said polyolefin matrix is distributed within said polyolefin composite in a distribution selected from the group consisting of ordered layers, ordered regions, random distribution, and combinations thereof.

9. The base material of claim 8, wherein said polyolefin matrix for holding together said oriented reinforcement components is of the form selected from the group consisting of powders, gels, mats, films, fibers, tapes, fabrics, and combinations thereof.

10. The base material of claim 1, wherein said electroconductive material is selected from the group consisting of a copper foil, a silver foil, a gold foil and an electroconductive polymer sheet.

11. The base material of claim 1, wherein a surface of each of said at least one dielectric layers, said surface facing one of said at least one conductive layers, includes exposed free ends of broken polyolefin fibrils.

12. The base material of claim 1, wherein said at least one dielectric layers and said at least one electroconductive layer are bonded together by a polar glue.

13. The base material of claim 8, wherein said base material is attached to at least one material selected from the group of conducting and semi-conducting materials, and wherein said base material has thermal expansion properties that are tailored to be substantially equal in all directions to those of said attached materials.

14. The base material of claim 1, wherein said at least one dielectric layer and said at least one electroconductive layer are bonded together by a non-polar substance.

15. The base material of claim 14, wherein said non-polar substance is selected from the group consisting of ultrahigh molecular weight polyethylene, high density polyethylene, low density polyethylene, and combinations thereof.

16. The base material of claim 15, wherein said non-polar substance is of the form selected from the group consisting of powders, gels, mats, films, fibers, tapes, fabrics, and combinations thereof.