Ultra high density integrated circuit packages
DCFirst Claim
1. A method of forming a thin integrated circuit package, comprising the steps of:
- (a) providing an integrated circuit package which comprises an integrated circuit element surrounded by a casing, said package having a first and a second major surface, and a perimeter wall defining the package height; and
(b) reducing the height of said package by uniformly removing material from one or both of said major surfaces.
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Accused Products
Abstract
Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The casing surrounding a die element may be reduced or eliminated in part to thin the level-one package provided any necessary steps are taken to ensure the integrity of the package. Moisture-barriers, as an example, may be provided to the upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may also be constructed with one or more metal layers to prevent warpage. These level-one packages may be aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors may be thermally coupled to the level-two package to help dissipate heat.
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Citations
18 Claims
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1. A method of forming a thin integrated circuit package, comprising the steps of:
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(a) providing an integrated circuit package which comprises an integrated circuit element surrounded by a casing, said package having a first and a second major surface, and a perimeter wall defining the package height; and
(b) reducing the height of said package by uniformly removing material from one or both of said major surfaces.
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2. A method of forming a thin integrated circuit package, comprising the steps of:
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(a) providing an integrated circuit package which comprises, an integrated circuit element formed on a semiconductor substrate, said integrated circuit element having an upper surface, a lower surface, and a perimeter wall, and a casing which surrounds said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall; and
(b) uniformly removing material from said lower surface of said casing until said lower surface of said integrated circuit element is exposed. - View Dependent Claims (3, 4, 5)
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6. A method of forming a thin integrated circuit package, comprising the steps of:
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(a) providing an integrated circuit package which comprises, an integrated circuit element formed on a semiconductor substrate, said integrated circuit element having an upper surface, a lower surface, and a perimeter wall, and a casing covering said upper surface and said perimeter wall of said integrated circuit element, said casing having an upper surface, and a perimeter wall; and
(b) uniformly removing material from said lower surface of said integrated circuit element. - View Dependent Claims (7)
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8. A method of forming a modular integrated circuit package, comprising the steps of:
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(a) providing a plurality of level-one integrated circuit packages each having a plurality of electrical interconnect leads extending therefrom;
(b) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns;
(c) mounting a plurality of thermally and electrically conductive rails adjacent to and oriented with said columns; and
(d) thermally and electrically coupling said rails to some or all of said leads in said columns.
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9. A method of forming a modular integrated circuit package, comprising the steps of:
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(a) providing a plurality of level-one integrated circuit packages, each including an integrated circuit element formed on a semiconductor substrate, and a lead frame electrically coupled to said integrated circuit element and having a plurality of electrical interconnect leads extending therefrom which provide an electrical path to said integrated circuit element;
(b) rendering one or more select leads of the lead frame in each level-one package inactive;
(c) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns; and
(d) electrically coupling all of said leads which are aligned in said columns and extend externally from said level-one packages. - View Dependent Claims (10, 11, 12, 13)
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14. A method of forming a modular integrated circuit package, comprising the steps of:
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(a) providing a plurality of level-one integrated circuit packages, each including an integrated circuit element formed on a semiconductor substrate, and a lead frame electrically coupled to said integrated circuit element and having a plurality of electrical interconnect leads extending therefrom which provide an electrical path to said integrated circuit element;
(b) rendering one or more select leads of the lead frame in each level-one package inactive;
(c) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns;
(d) mounting a plurality of thermally and electrically conductive rails adjacent to and oriented with said columns; and
(e) thermally and electrically coupling said rails to some or all of said leads in said columns and external to said level-one packages. - View Dependent Claims (15, 16, 17, 18)
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Specification