Photovoltaic devices comprising zinc stannate buffer layer and method for making
First Claim
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1. A thin-film Cds/CdTe heterojunction photovoltaic device that has front contact layer of transparent conductive oxide (TCO) and further comprises:
- a layer of zinc stannate interposed between the transparent conducting oxide (TCO) layer and the thin-film CdS/CdTe.
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Abstract
A photovoltaic device has a buffer layer zinc stannate Zn2SnO4 disposed between the semiconductor junction structure and the transparent conducting oxide (TCO) layer to prevent formation of localized junctions with the TCO through a thin window semiconductor layer, to prevent shunting through etched grain boundaries of semiconductors, and to relieve stresses and improve adhesion between these layers.
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Citations
29 Claims
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1. A thin-film Cds/CdTe heterojunction photovoltaic device that has front contact layer of transparent conductive oxide (TCO) and further comprises:
a layer of zinc stannate interposed between the transparent conducting oxide (TCO) layer and the thin-film CdS/CdTe. - View Dependent Claims (2)
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3. A method of preventing localized TCO/CdTe junctions in a thin-film CdS/CdTe heterjunction photovoltaic device that has a CdS layer and aCdTe layer and in which the CdS layer is pouitioned between a front contact layer of transparent conductive oxide (TCO) and the CdTe layer, wherein the method comprises:
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interposing a layer of zinc stannate between the layer of transparent conductive oxide (TCO) and the CdS layer. - View Dependent Claims (4, 5, 7)
heat treating the CdS layer and the CdTe layer together with the layer of zinc stannate and the TCO front contact layer at a temperature of about 600°
C.
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7. The method of claim 5, wherein said zinc stannate is spinel crystalline Zn2SnO4.
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6. A method of preventing etched grain boundary shunts between a metallic back contact layer and a TCO front contact layer in a thin-film CdS/CdTe heterojunction photovoltaic device that has a CdS layer and a CdTe layer positioned between the transparent conductive oxide (TCO) front contact layer and the metallic back contact layer, wherein the method comprises:
interposing a layer of zinc stannate between the TCO front contact layer and the CdS layer.
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8. A method of relieving interlayer stresses and preventing blistering and peeling from heat treating a CdS layer and a CdTe layer in a thin-film CdS/CdTe heterojunction photovoltaic device that has a CdS layer and a CdTe layer with a transparent conductive oxide (TCO) front contact layer positioned between a substrate and the CdS layer, wherein the method comprises:
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interposing a layer of zinc stannate between the TCO front contact layer and the CdS layer prior to the heat treating. - View Dependent Claims (9, 10)
heat treating the CdS layer and the CdTe layer together with the layer of zinc stannate and the TCO front contact layer at a temperature in a range of about 400 to 700°
C.
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11. A method of fabricating a thin-film CdS/CdTe heterojunction device, comprising:
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depositing a TCO layer on a transparent substrate;
depositing a zinc stannate layer on the TCO layer;
depositing a CdS/CdTe heterojunction structure on the zinc stannate layer;
annealing the CdS/CdTe heterojunction structure;
surface etching the CdS/CdTe heterojunction structure to obtain a p+ surface region; and
depositing a back contact on the CdTe layer with a p+ surface region. - View Dependent Claims (12)
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13. A thin-film photovoltaic device comprising:
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a substrate;
a film of transparent conductive oxide disposed on said substrate as a front contact;
a film of Zn2SnO4 disposed on said film of transparent conductive oxide;
a thin film comprising two or more layers of semiconductor materials forming a p/n or a p/i/n junction disposed on said film of Zn2SnO4; and
an electrically conductive film disposed on said thin film of semiconductor materials to form a rear electrical contact to said thin film. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method for fabricating a photovoltaic device, comprising:
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depositing a film of transparent conductive oxide onto a substrate;
depositing a film of Zn2SnO4 onto said film of transparent conductive oxide;
depositing onto said film of Zn2SnO4 a thin film comprising dissimilar semiconductor materials that together form a p/n or a p/i/n junction; and
depositing an electrically conductive film onto said thin film of semiconductor materials to provide an electrical contact therewith. - View Dependent Claims (25, 26, 27, 28, 29)
(a) RF sputter coating a substantially amorphous Zn2SnO4 layer onto said film of transparent conductive oxide; and
(b) heating the Zn2SnO4 layer and semiconductor materials to a treatment temperature sufficient to induce crystallization of the Zn2SnO4 layer into a uniform single-phase spinel structure and for a time sufficient to allow full crystallization of the Zn2SnO4 layer at the treatment temperature to produce a poly-crystal Zn2SnO4 film.
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26. The method of claim 25, wherein said substantially amorphous Zn2SnO4 layer is sputter coated onto said film of transparent conductive oxide at room temperature.
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27. The method of claim 25, wherein said substantially amorphous Zn2SnO4 layer is RF sputtered onto said film of transparent conductive oxide in an atmosphere consisting essentially of oxygen.
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28. The method of claim 25, wherein said treatment temperature is less than about 650°
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29. The method of claim 24, wherein said step of depositing a thin film of semiconductor materials onto said layer of Zn2SnO4 comprises a chemical bath deposition, or an RF sputtering deposition, or a close-space sublimation deposition.
Specification