Method and system for locally annealing a microstructure formed on a substrate and device formed thereby

• US 6,169,321 B1
• Filed: 05/05/1999
• Issued: 01/02/2001
• Est. Priority Date: 06/13/1997
• Status: Expired due to Term

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Wang, Kun, Nguyen, Clark T. -C
• Primary Examiner(s): HARDY, DAVID B
• Application Number:
  US09/305,513
• Time in Patent Office: 608 Days
• Field of Search: 438/795, 257/467, 257/528, 257/536, 257/70, 257/75
• US Class Current: 257/536
• CPC Class Codes: H03H 9/02401 by annealing

Abstract

A batch-compatible, post-fabrication annealing method and system are described that can be used to trim the resonance frequency and enhance the quality factor of mechanical microstructures, particularly micromechanical structures, such as micromechanical resonators. The technique involves running a current through a micromechanical structure, or through a nearby microstructure (e.g., a nearby resistor), thereby dissipating power and heating the structure to temperatures high enough to change its microstructure and/or its material properties, which then lead to changes in the microstructure'"'"'s resonance frequency and quality factor. For micromechanical structures, this technique is particularly useful, since it allows for convenient, simultaneous trimming of many microstructures all at once, and can be implemented via the simple application of a voltage across the anchor points of a micromechanical structure.

Claims

1. A system for locally annealing a predetermined microstructure formed on a substrate of a device, the system comprising:

an annealing power supply; and

means adapted to be coupled to a microscopic part of the device for transferring power from the annealing power supply to the microscopic part in the form of an electrical signal so that microscopic part of the device converts the transferred power to a controlled amount of heat over a period of time sufficient to change material and/or microstructural properties of the predetermined microstructure without significantly affecting any other microstructure formed on the substrate.

2. The system as claimed in claim 1 wherein the predetermined microstructure is a micromechanical device.

3. The system as claimed in claim 2 wherein the micromechanical device is a micromechanical resonator having a resonance frequency and a Q factor.

4. The system as claimed in claim 3 wherein the heat is sufficient to cause the resonance frequency of the resonator to change.

5. The system as claimed in claim 4 further comprising an electrical power supply adapted to be coupled to a driver of the resonator for supplying an electrical drive signal to the driver so that the resonator oscillates and a controller for monitoring the resulting resonance frequency wherein the controller controls the electrical signal from the annealing power supply until the resonator has a desired resonance frequency.

6. The system as claimed in claim 3 wherein the heat is sufficient to cause the Q factor to change.

7. The system as claimed in claim 3 wherein the heat is sufficient to cause the resonance frequency and the Q factor to change.

8. The system as claimed in claim 3 wherein the micromechanical resonator includes a beam having a pair of anchors.

9. The system as claimed in claim 3 wherein the micromechanical resonator is a folded-beam resonator.

10. The system as claimed in claim 1 wherein the micromechanical resonator is a polysilicon resonator.

11. The system as claimed in claim 1 wherein the microscopic part of the device is the predetermined microstructure.

12. The system as claimed in claim 1 wherein the electrical signal is a time-varying signal.

13. The system as claimed in claim 12 wherein the time-varying signal is a signal having at least one pulse.

14. The system as claimed in claim 11 wherein the device has a pair of electrodes coupled at spaced positions to the microstructure and wherein the electrical signal is applied at the electrodes.

15. The system as claimed in claim 1 wherein the substrate is a semiconductor substrate.

16. The system as claimed in claim 15 wherein the semiconductor substrate is a silicon semiconductor substrate.

17. The system as claimed in claim 1 wherein the predetermined microstructure is a semiconductor microstructure.

18. The system as claimed in claim 17 wherein the semiconductor microstructure is a silicon semiconductor microstructure.

19. The system as claimed in claim 18 wherein the predetermined microstructure has an amorphous silicon microstructure and wherein the heat is sufficient to change the amorphous silicon microstructure to a polycrystalline or crystalline silicon microstructure.

20. The system as claimed in claim 1 wherein the microstructure forms part of a microelectromechanical device.

21. A device having at least one microstructure formed on a substrate, the improvement comprising:

electrodes formed on the substrate and electrically coupled to a predetermined microstructure to receive an electrical signal which, in turn, causes an electrical current to flow through the predetermined microstructure to controllably and directly heat the predetermined microstructure over a period of time sufficient to change material and/or microstructural properties of the predetermined microstructure without substantially affecting any other microstructure formed on the substrate.

22. The device as claimed in claim 21 wherein the microstructure is a micromechanical device having anchors and wherein the electrodes are electrically coupled to their respective anchors.

23. A device having at least one microstructure formed on a substrate, the improvement comprising:

a microplatform formed on and thermally isolated from the substrate;

at least one microstructure formed on the microplatform; and

a resistive heating element formed on the microplatform and adapted to receive a signal which, in turn, causes the element to indirectly heat any microstructure formed on the microplatform including the at least one microstructure over a period of time sufficient to change material and/or microstructural properties of the at least one microstructure without substantially affecting any other microstructure formed on the substrate but not on the microplatform.

24. The device as claimed in claim 23 wherein the at least one microstructure is a micromechanical device.

25. A device having at least one microstructure formed on a substrate, the improvement comprising:

a resistive heating element formed on the substrate immediately adjacent a predetermined microstructure and adapted to receive a signal which, in turn, causes the element to indirectly heat the predetermined microstructure over a period of time sufficient to change material and/or microstructural properties of the predetermined microstructure without substantially affecting any other microstructure on the substrate.

26. The device as claimed in claim 25 wherein the microstructure is a micromechanical device.