Soldering method using a flux containing borneol

• US 6,170,735 B1
• Filed: 11/08/1999
• Issued: 01/09/2001
• Est. Priority Date: 06/23/1997
• Status: Expired due to Fees

• Current Assignee: Delco Electronics Corporation (General Motors Company)
• Original Assignee: Delco Electronics Corporation (General Motors Company)
• Inventors: Young, Mary Beth, Summers, David Ross, Bristol, Samuel Victor
• Primary Examiner(s): ANDREWS, MELVYN J
• Application Number:
  US09/435,688
• Time in Patent Office: 428 Days
• Field of Search: 148/23, 148/24, 148/25, 228/207, 228/223, 228/224
• US Class Current: 228/207
• CPC Class Codes: B23K 35/3612 with organic compounds as principal constituents
• CPC Class Codes: B23K 35/3618 Carboxylic acids or salts
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/81907 Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step

Abstract

A soldering flux containing borneol, which is also referred to as bornyl alcohol. A method soldering using such a flux is also disclosed. Even minor proportions of borneol in the flux help reduce ionic residue from the flux after soldering. Larger proportions of borneol can give the flux tackiness for wave soldering operations. The flux preferably comprises borneol and an organic acid activator that volatilizes during soldering. The flux is applied as a solution of borneol and the organic acid activator in a solvent that substantially evaporates before soldering without leaving any measurable solvent residue.

Claims

1. A method of soldering electrical components, the method comprising the steps of:

applying a flux solution to a first surface, the flux solution consisting essentially of borneol, a volatile vehicle, and optionally one or more constituents chosen from the group consisting of activators, wetting agents and surfactants;

allowing said volatile vehicle to substantially evaporate and leave a coating of a borneol-containing flux composition on said first surface; and

then

soldering said first surface to a second surface.

2. The method of claim 1 wherein said first surface is a composite material circuit board and the borneol concentration in said flux solution is at least about 10% by weight.

3. The method of claim 1 wherein said first surface is a ceramic substrate for a hybrid integrated circuit and the borneol concentration in said flux solution is less than about 1% by weight.

4. The method of claim 1 wherein one of said first and second surfaces is a semiconductor wafer having a silicon nitride coating and contact bumps with solder thereon.

5. The method of claim 1 wherein said flux solution contains an organic acid activator and a wetting agent and/or surfactant as a solution modifying agent that also serves as an activator.

6. The method of claim 5 wherein said organic acid activator and said solution modifying agent each comprise about 1%-5% by weight, of said flux solution.

7. The method of claim 1 wherein said flux solution contains at least one organic acid activator.

8. The method of claim 1 wherein said flux solution consists of about 0.1% to 25% by weight of said borneol, said volatile vehicle, at least one organic acid activator, optionally at least one wetting agent, and optionally at least one surfactant.