Method of fabricating a thin film transistor including forming a trench and forming a gate electrode on one side of the interior of the trench

• US 6,170,815 B1
• Filed: 12/14/1998
• Issued: 01/09/2001
• Est. Priority Date: 12/17/1997
• Status: Expired due to Term

• Current Assignee: Hyundai Electronics Industries Co. Ltd. (SK Hynix Inc.)
• Original Assignee: Hyundai Electronics Industries Co. Ltd. (SK Hynix Inc.)
• Inventors: Gil, Gyoung-Seon
• Primary Examiner(s): Bowers, Charles
• Assistant Examiner(s): Brewster, William M.
• Application Number:
  US09/210,774
• Time in Patent Office: 757 Days
• Field of Search: 438/156, 438/206, 438/270, 438/286, 438/589, 257/322, 257/329
• US Class Current: 438/270
• CPC Class Codes: H01L 29/66742 Thin film unipolar transistors
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 29/78642 Vertical transistors

Abstract

A thin film transistor and a fabrication method thereof in which a desired device characteristic is achieved by adjusting the lengths of a channel region and an offset region. The transistor includes a substrate in which a trench is formed, a gate electrode formed in one side in the interior of the trench, a gate insulation film formed in the substrate including the gate electrode, an active layer formed on the gate insulation film, and impurity regions formed on the active layer corresponding to the substrate. The length of the channel and offset regions are adjusted by adjusting the length and width of the trench within the substrate.

Claims

1. A method for fabricating a thin film transistor, comprising:

forming a trench in a substrate;

forming a gate electrode entirely within the trench and on one side in an interior of the trench;

forming a gate insulation film on the substrate and the gate electrode;

forming an active layer on the gate insulation film;

forming an insulation film on a portion of the active layer corresponding to the trench; and

forming impurity regions on the active layer using the insulation film as a mask.

2. The method of claim 1, wherein said substrate is formed of an insulation member.

3. The method of claim 1, further comprising:

forming the substrate with an insulation film formed on a semiconductor member.

4. The method of claim 1, wherein the forming the gate electrode step includes:

forming an impurity-doped polysilicon film on the substrate and the trench; and

anisotropic-etching the polysilicon film.

5. The method of claim 1, wherein said active layer is formed of a semiconductor film.

6. The method of claim 1, wherein the upper surface of the insulation film and both surfaces of the active layer are formed in a same plane.

7. The method of claim 1, wherein a channel region corresponding to the gate electrode is formed on the active layer.

8. The method of claim 1, wherein an offset region is formed between the channel region of the active layer and the impurity regions.

9. The method of claim 8, wherein a length of the offset region depends upon a width and depth of the trench.

10. The method of claim 1, wherein a portion of said active layer corresponding to the gate electrode is a channel region, and a portion of said active layer corresponding to a lower surface and at least one lateral surface of the trench is an offset region.

11. The method of claim 1, wherein the forming an insulation film step comprises:

forming an insulating layer over the substrate; and

etching the insulating layer until the portions of the active layer outside the trench are exposed.

12. The method of claim 11, wherein the etching step etches the insulating layer until portions of the active layer outside the trench are exposed and a planar upper surface is produced.

13. The method of claim 1, wherein the forming an insulating film step forms the insulating film such that an upper surface of the insulating film is co-planar with upper surfaces of the active layer outside the trench.

14. The method of claim 4, wherein the forming the gate electrode step further comprises:

forming a mask over one of two polysilicon film portions, each formed on a respective side of the trench after the anisotropic-etching step; and

removing an unmasked one of the two polysilicon film portions.