Method for making ink-jet printer nozzles

• US 6,171,510 B1
• Filed: 10/30/1997
• Issued: 01/09/2001
• Est. Priority Date: 10/30/1997
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Lee, William T.
• Primary Examiner(s): Gulakowski, Randy
• Assistant Examiner(s): OLSEN, ALLAN W
• Application Number:
  US08/960,769
• Time in Patent Office: 1,167 Days
• Field of Search: 216/27, 216/46, 216/57, 216/72, 216/75, 216/78, 216/100
• US Class Current: 216/27
• CPC Class Codes: B41J 2/1433 Structure of nozzle plates
• CPC Class Codes: B41J 2/162 Manufacturing of the nozzle plates
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching

Abstract

A method for forming a chamber or nozzle structure in a substrate. The chamber is formed by first creating a surface feature, such as a pit or trench, on the surface of the substrate. A layer of resist is applied to the sidewall of the surface feature and the substrate is isotropically etched such that the etch works back up the inside of the resist on the surface feature sidewall to form a re-entrant angle between the surface feature sidewall and the top of the chamber wall. This results in a chamber that is wider than the opening between the sidewalls of the surface feature. An anisotropic etch step may be performed before or after the isotropic etch step or steps to control the final shape of the chamber.

Claims

1. A method of etching a substrate with a top surface, a portion of the top surface defining a feature with a sidewall and a bottom, the method comprising:

forming an etch stop in the substrate;

forming a layer of resist over the sidewall of the feature wherein a portion of the resist disposed on the sidewall portion of the feature has a front surface and a back surface, the back surface of the portion of the resist being oriented toward the sidewall of the surface feature, but not over at least a portion of the bottom of the feature; and

isotropically etching the substrate with a plasma to expose at least a portion of the back surface of the resist, wherein the etch stop limits the etching depth thereby forming a generally planar surface at the juncture of the bottom of the feature and the etch stop.

3. The method of claim 1 wherein isotropically etching the substrate includes etching back toward the top surface of the substrate.

26. The method of claim 1 wherein the etch stop comprises titanium.

27. The method of claim 1 wherein the etching step forms a chamber below the feature, the chamber having a width greater than the feature width.

28. The method of claim 27 wherein the chamber wall and the planar surface form an oblique shaped bowl.

29. The method of claim 1 further comprising removing the exposed etch stop and the resist.

30. The method of claim 29 further comprising sputter etching an upper portion of the sidewall of the feature to form a countersunk facet.

2. A method of etching a substrate with a top surface, a portion of the top surface defining a feature with a sidewall and a bottom, the method comprising:

forming a layer of resist over the sidewall of the feature wherein a portion of the resist disposed on the sidewall portion of the feature has a front surface and a back surface, the back surface of the portion of the resist being oriented toward the sidewall of the surface feature, but not over at least a portion of the bottom of the feature; and

isotropically etching the substrate with a plasma to expose at least a portion of the back surface of the resist,

wherein the layer of resist comprises photoresist.

4. A method of forming a chamber in a material having an upper surface, the method comprising:

forming an etch stop in the substrate;

forming a resist layer on the upper surface, the material having a cavity extending below the upper surface, the cavity having a width, a bottom surface, and a sidewall;

patterning the resist layer to cover at least a first portion of the upper surface and at least a second portion of the sidewall, but leaving at least a third portion of the bottom surface exposed, wherein a portion of the resist disposed on the sidewall has a front surface and a back surface; and

isotropically etching the material to form a chamber below the cavity, thereby exposing at least a portion of the back surface of the resist, the chamber having a chamber width greater than the cavity width, wherein a chamber wall forms a re-entrant angle with the sidewall, wherein the etch stop limits the etching depth thereby forming a generally planar surface at the juncture of the bottom of the feature and the etch stop.

6. The method of claim 4 wherein the cavity is a trench.

7. The method of claim 4 wherein the material comprises a semiconductor.

11. The method of claim 4 further comprising anisotropically etching the bottom surface to deepen the cavity after patterning the resist layer and before isotropically etching the material.

12. The method of claim 4 wherein the material comprises a plurality of layers.

13. The method of claim 4 wherein the chamber wall forms an angle greater than 90 degrees with a back wall of the chamber.

5. A method of forming a chamber in a material having an upper surface, the method comprising:

forming a resist layer on the upper surface, the material having a cavity extending below the upper surface, the cavity having a width, a bottom surface, and a sidewall;

patterning the resist layer to cover at least a first portion of the upper surface and at least a second portion of the sidewall, but leaving at least a third portion of the bottom surface exposed; and

isotropically etching the material to form a chamber below the cavity, the chamber having a chamber width greater than the cavity width, wherein a chamber wall forms a re-entrant angle with the sidewall, wherein the cavity is a pit.

8. A method of forming a chamber in a material having an upper surface, the method comprising:

forming a resist layer on the upper surface, the material having a cavity extending below the upper surface, the cavity having a width, a bottom surface, and a sidewall;

patterning the resist layer to cover at least a first portion of the upper surface and at least a second portion of the sidewall, but leaving at least a third portion of the bottom surface exposed; and

isotropically etching the material to form a chamber below the cavity, the chamber having a chamber width greater than the cavity width, wherein a chamber wall forms a re-entrant angle with the sidewall,

wherein the material comprises an oxide.

9. The method of claim 8 wherein the oxide comprises silicon glass.

10. A method of forming a chamber in a material having an upper surface, the method comprising:

forming a resist layer on the upper surface, the material having a cavity extending below the upper surface, the cavity having a width, a bottom surface, and a sidewall;

patterning the resist layer to cover at least a first portion of the upper surface and at least a second portion of the sidewall, but leaving at least a third portion of the bottom surface exposed; and

isotropically etching the material to form a chamber below the cavity, the chamber having a chamber width greater than the cavity width, wherein a chamber wall forms a re-entrant angle with the sidewall,

wherein the material comprises silicon nitride.

14. A method of forming a nozzle structure, the method comprising:

forming a layer on a substrate, the layer having a surface;

forming an etch stop between the layer and the substrate;

forming a surface feature in the surface of the layer, the surface feature having a sidewall and a bottom surface;

covering at least a first portion of the sidewall of the surface feature and at least a second portion of the surface of the layer with a resist layer, leaving at least a third portion of the bottom surface of the surface feature exposed; and

isotropically etching the layer to form a chamber below the surface feature wherein the etch stop prevents etching into the substrate and wherein a chamber wall forms a re-entrant angle with the sidewall of the surface feature.

15. The method of claim 14 further comprising anisotropically etching the bottom surface to deepen the surface feature after said covering and before said isotropically etching.

18. The method of claim 14 wherein the substrate is a silicon wafer.

19. The method of claim 18 wherein the silicon wafer includes an ink driver structure coupled to the chamber.

20. The method of claim 19 wherein the silicon wafer further includes integrated drive circuitry.

24. The method of claim 14 wherein the surface feature has a cross section with a minimum dimension between about 1-50 microns.

25. The method of claim 14 wherein an angle formed by the chamber wall and a back wall of the chamber is greater than 90 degrees.

31. The method of claim 14 wherein the etch stop comprises titanium.

32. The method of claim 14 wherein the layer etches at a quicker rate than the etch stop thereby resulting in a generally planar backwall of the chamber.

33. The method of claim 32 wherein the juncture of the chamber wall and the planar backwall forms an oblique bowl shape.

16. A method of forming a nozzle structure, the method comprising:

forming a layer on a substrate, the layer having a surface;

forming a surface feature in the surface of the layer, the surface feature having a sidewall and a bottom surface;

covering at least a first portion of the sidewall of the surface feature and at least a second portion of the surface of the layer with a resist layer, leaving at least a third portion of the bottom surface of the surface feature exposed; and

isotropically etching the layer to form a chamber below the surface feature wherein a chamber wall forms a re-entrant angle with the sidewall of the surface feature,

wherein the layer comprises a ceramic.

17. The method of claim 16 wherein the substrate includes silicon glass.

21. A method of forming a nozzle structure, the method comprising:

forming a layer on a substrate, the layer having a surface;

forming a surface feature in the surface of the layer, the surface feature having a sidewall and a bottom surface;

covering at least a first portion of the sidewall surface feature and at least a second portion of the surface of the layer with a resist layer, leaving at least a third portion of the bottom surface of the surface feature exposed; and

isotropically etching the layer to form a chamber below the surface feature wherein a chamber wall forms a re-entrant angle with the sidewall of the surface feature,

wherein the layer is formed by a chemical vapor deposition process.

22. A method of forming a nozzle structure, the method comprising:

forming a layer on a substrate, the layer having a surface;

forming a surface feature on the surface of the layer, the surface feature having a sidewall and a bottom surface;

covering at least a first portion of the sidewall of the surface feature and at least a second portion of the surface of the layer with a resist layer, leaving at least a third portion of the bottom surface of the surface feature exposed; and

isotropically etching the layer to form a chamber below the surface feature wherein a chamber wall forms a re-entrant angle with the sidewall of the surface feature,

wherein the layer is formed by a spin on-glass process.

23. A method of forming a nozzle structure, the method comprising:

forming a layer on a substrate, the layer having a surface;

forming a surface feature in the surface of the layer, the surface feature having a sidewall and a bottom surface;

covering at least a first portion of the sidewall of the surface feature and at least a second portion of the surface of the layer with a resist layer, leaving at least a third portion of the bottom surface of the surface feature exposed; and

isotropically etching the layer to form a chamber below the surface feature wherein a chamber wall forms a re-entrant angle with the sidewall of the surface feature,

wherein the layer is formed by a physical vapor deposition process.