Method for forming a thick-film resistor and thick-film resistor formed thereby

• US 6,171,921 B1
• Filed: 06/05/1998
• Issued: 01/09/2001
• Est. Priority Date: 06/05/1998
• Status: Expired due to Fees

• Current Assignee: Motorola Solutions, Inc.
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Dunn, Gregory J., Scheifers, Steven M.
• Primary Examiner(s): Wilczewski, Mary
• Assistant Examiner(s): GOODWIN, DAVID J
• Application Number:
  US09/093,007
• Time in Patent Office: 949 Days
• Field of Search: 338/309, 338/307, 338/314, 338/204, 338/338, 338/209, 338/382, 438/382, 438/399, 257/516, 257/520, 257/538, 427/101, 427/102, 427/103
• US Class Current: 438/382
• CPC Class Codes: H01C 17/003 using lithography, e.g. photolithography lithographic compositions and processing in general G03F
• CPC Class Codes: H01C 17/065 by thick film techniques, e.g. serigraphy
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2203/0568 Resist used for applying paste, ink or powder
• CPC Class Codes: H05K 3/0023 by exposure and development of a photosensitive insulating layer
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An opening is photodefined in the surface of the photoimageable layer, and then overfilled with an electrically-resistive material to form a resistive mass having an excess portion that lies on the surface of the photoimageable layer surrounding the opening. Following curing which causes the surface of the resistive material to become recessed below the surface of the photoimageable layer, the excess portion of the resistive mass is removed, preferably by abrading or a similar operation, such that the lateral dimensions of the resistive mass are determined by the lateral dimensions of the opening in the photoimageable layer. Thereafter, subsequent processing is preformed to include the photoimageable layer as a permanent photoimageable layer of a circuit board, with the resistive mass and appropriate terminations forming a resistor in the permanent photoimageable layer.

Claims

1. A method for forming a thick-film resistor, the method comprising the steps of:

forming a dielectric layer on a substrate, said dielectric layer having a surface;

defining an opening in the dielectric layer;

depositing an electrically resistive material in the opening such that the electrically resistive material forms a resistive mass having a surface portion recessed below the surface of the dielectric layer and a portion that lies on the surface of the dielectric layer surrounding the opening; and

removing the portion of the resistive mass that lies on the surface of the dielectric layer such that the resistive mass has lateral dimensions defined by the opening in the dielectric layer.

2. A method as recited in claim 1, wherein the dielectric layer is photoimageable.

3. A method as recited in claim 2, wherein the resistive mass is heated to cure the electrically resistive material prior to the step of removing the portion of the resistive mass that lies on the surface of the dielectric layer.

4. A method as recited in claim 1, wherein the step of removing the portion of the resistive mass that lies on the surface of the dielectric layer entails an abrading operation.

5. A method as recited in claim 1, further comprising the steps of:

forming a second dielectric layer on the dielectric layer and over the resistive mass after the step of removing the portion of the resistive mass that lies on the surface of the dielectric layer, the second dielectric layer having openings therein so as to expose at least two regions of the resistive mass; and

depositing electrically-conductive material in the openings of the second dielectric layer so as to form terminals that, with the resistive mass, form the thick-film resistor.

6. A method as recited in claim 1, further comprising the step of forming electrical terminals that underlie the resistive mass.

7. A method as recited in claim 6, wherein the electrical terminals are applied to the substrate, and wherein the step of defining the opening in the surface of the dielectric layer exposes the electrical terminals.

8. A method as recited in claim 1, wherein the electrically resistive material is deposited in the opening by a screen printing operation.

9. A method for forming a thick-film resistor, the method comprising the steps of:

forming on a substrate a photoimageable dielectric layer having a thickness in a direction normal to a surface of the substrate;

photolithographically defining an opening in a surface of the photoimageable dielectric layer so as to form an edge on the photoimageable dielectric layer that surrounds the opening, the opening being characterized by a length, a width transverse to the length, and a depth equal to the thickness of the photoimageable dielectric layer;

screen printing an ink in the opening such that the ink fills the opening and overlies the edge of the photoimageable dielectric layer, the ink comprising carbon particles in a phenolic resin matrix;

heating the ink so as to form a resistive mass having a surface portion recessed below the surface of the photoimageable dielectric layer; and

abrasively removing the portion of the resistive mass that overlies the edge of the photoimageable dielectric layer such that the resistive mass has a length and a width equal to the length and width, respectively, of the opening, and a thickness less than the thickness of the photoimageable dielectric layer.

10. A method as recited in claim 9, wherein the heating step serves to cure the curable matrix of the ink.

11. A method as recited in claim 9, wherein the surface portion of the resistive mass is substantially unaltered during removal of the portion of the resistive mass.

12. A method as recited in claim 9, further comprising the steps of:

forming a second photoimageable dielectric layer on the photoimageable dielectric layer and over the resistive mass, the second photoimageable dielectric layer having openings therein so as to expose at least two regions of the resistive mass; and

depositing electrically conductive material in the openings in the second photoimageable dielectric layer so as to form terminals that, with the resistive mass, form a thick-film resistor.

13. A method as recited in claim 9, further comprising the step of depositing electrically conductive material on the substrate so as to form electrical terminals that underlie the resistive mass and, with the resistive mass, form a thick-film resistor.