High-frequency wave measurement substrate

• US 6,172,497 B1
• Filed: 11/20/1998
• Issued: 01/09/2001
• Est. Priority Date: 11/21/1997
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Okumichi, Takehiro
• Primary Examiner(s): Metjahic, Safet
• Assistant Examiner(s): TANG, MINH NHUT
• Application Number:
  US09/196,547
• Time in Patent Office: 781 Days
• Field of Search: 324/158.1, 324/754, 333/26, 333/33, 333/246, 333/247, 333/260
• US Class Current: 324/754.06
• CPC Class Codes: H01P 5/08 for linking dissimilar lines or devices H01P1/16, H01P5/04 take precedence; linking lines of the same kind but with different dimensions H01P5/02

Abstract

A high frequency wave measurement substrate comprising a dielectric substrate, a ground conductor being formed almost all over a bottom surface of the dielectric substrate, a microstrip line signal conductor and an radial stub-like equivalent ground conductor which is placed in proximity to an end of the microstrip line signal conductor being formed on a top surface of the dielectric substrate, a coplanar line structure wafer probe signal conductor and a ground conductor being electrically connected to both the signal conductor and the equivalent ground conductor, wherein the equivalent ground conductor is composed of a semi-circular or fan-shaped radial stub-like conductor pattern in which non-conductor areas are formed in its radial direction. The equivalent ground conductor is also composed of a plurality of radial conductors which are sharing a center with each other, disposed like an arc, and different from each other in length in the radial direction, and a connecting conductor for electrically connecting the radial conductors to each other electrically. In the high-frequency wave measurement substrate a product of a thickness h of the substrate and a square root of a relative dielectric constant ε_r of the substrate is set to be {fraction (1/12)} or more and ⅕ or less of a vacuum wavelength λ_max of a measurement upper limit frequency. Consequently, the standing charge density distribution in the circumferential direction is caused by lower frequencies, so that the low loss transmission frequency band can be expanded.

Claims

1. A high-frequency wave measurement substrate comprising:

a dielectric substrate,

a ground conductor formed on a bottom surface of the dielectric substrate,

a microstrip line signal conductor formed on a top surface of the dielectric substrate,

a coplanar line portion signal conductor formed on the top surface of the substrate and electrically connected to the microstrip line signal conductor, and

a semi-circular or fan-shaped radial-stub-like equivalent ground conductor formed on the top surface of the dielectric substrate and disposed in proximity to the coplanar line portion signal conductor,

the ground conductor being electrically connected to the equivalent ground conductor,

wherein a non-conductor area is provided in part of the fan shape in a radial direction, the equivalent ground conductor being a contiguous area.

2. The high-frequency wave measurement substrate of claim 1, wherein a length of the non-conductor area in the radial direction is equal to or more than a half of a width of the equivalent ground conductor in the radial direction.

3. The high-frequency wave measurement substrate of claim 1, wherein the non-conductor area is positioned at about ¼

or about ¾

of a center angle of the equivalent ground conductor.

4. The high-frequency wave measurement substrate of claim 1, wherein one end of the non-conductor area in the radial direction is opened to an inner or outer periphery of the equivalent ground conductor.

8. The high-frequency wave measurement substrate of claim 1 or 5, wherein a product of a thickness h of the substrate and a square root of a relative dielectric constant ε

_r of the substrate is set to be within a range of from {fraction (1/12)} to ⅕

of a vacuum wavelength λ

_max of a measurement upper limit frequency, namely λ

_max/12≦

{square root over ( )}ε

_r≦

μ

_max/5.

5. A high-frequency wave measurement substrate comprising:

a dielectric substrate,

a ground conductor formed on a bottom surface of the dielectric substrate,

a microstrip line signal conductor formed on a top surface of the dielectric substrate,

a coplanar line portion signal conductor formed on the top surface of the substrate and electrically connected to the microstrip line signal conductor, and

a radial-stub-like equivalent ground conductor formed on the top surface of the dielectric substrate and disposed in proximity to the coplanar line portion signal conductor,

the ground conductor being electrically connected to the equivalent ground conductor,

wherein the equivalent ground conductor is composed of a plurality of co-centric radial conductors disposed along an arc and having different widths in a radial direction, and a connecting conductor electrically connecting the radial conductors to each other.

6. The high-frequency wave measurement substrate of claim 5, wherein a length of the connecting conductor in the radial direction is equal to or less than a half of the length of the shortest radial conductor in the radial direction.

7. The high-frequency wave measurement substrate of claim 5, wherein a plurality of the radial conductors are divided into a center radial conductor to be disposed in the center and outside radial conductors disposed at both sides of the center radial conductor and the center angles of the outside radial conductors are about ½

of that of the center radial conductor respectively.