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Method and apparatus for removing die from a wafer and conveying die to a pickup location

  • US 6,173,750 B1
  • Filed: 02/17/1999
  • Issued: 01/16/2001
  • Est. Priority Date: 02/18/1998
  • Status: Expired due to Term
First Claim
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1. A die feeder for feeding in series a collection of components attached to a flexible film having a substantially planar surface, the die feeder comprising:

  • a support operable to support said flexible film in the substantially planar configuration;

    a component conveyor belt adjacent to the flexible film and extending substantially horizontally from a location adjacent to said support to a pickup location; and

    a pick head operable to remove a selected component from said collection of components on said flexible film and place said selected component directly on said component conveyor belt at the location adjacent to said support for transport of the selected component by said component conveyor belt to the pickup position.

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