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High density Z-axis connector

  • US 6,174,175 B1
  • Filed: 04/29/1999
  • Issued: 01/16/2001
  • Est. Priority Date: 04/29/1999
  • Status: Expired due to Fees
First Claim
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1. A method of making electrical connection between electronic devices each having a set of electrical contacts to be respectively connected to the other with the set of electrical contacts of at least one of said electronic devices being solder ball contacts, comprising:

  • positioning in both the X and Y directions a uniform array of rigid conductive metal columns orthogonal to a plane between said devices with each of said conductive metal columns of said array of conductive metal columns being parallel to one another and no more than 25 microns in diameter and 50 microns apart and electrically insulated from one another and held in a layer of material so as to extend beyond each of the opposing surfaces thereof with the spacing between said conductive metal columns sufficient to cause more than one conductive metal column of said array of conductive metal columns to align with each of the electrical contacts of said set of electrical contacts of each of said electronic devices to be respectively connected to the other; and

    applying sufficient loading force to said electronic devices so as to cause said rigid conductive metal columns to make conductive contact with each of the electrical contacts of said electronic devices to be connected with said loading force sufficient to cause more than one of said conductive metal columns to form indentations into each of said solder ball contacts of said at least one of said electronic devices.

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