High density Z-axis connector
First Claim
1. A method of making electrical connection between electronic devices each having a set of electrical contacts to be respectively connected to the other with the set of electrical contacts of at least one of said electronic devices being solder ball contacts, comprising:
- positioning in both the X and Y directions a uniform array of rigid conductive metal columns orthogonal to a plane between said devices with each of said conductive metal columns of said array of conductive metal columns being parallel to one another and no more than 25 microns in diameter and 50 microns apart and electrically insulated from one another and held in a layer of material so as to extend beyond each of the opposing surfaces thereof with the spacing between said conductive metal columns sufficient to cause more than one conductive metal column of said array of conductive metal columns to align with each of the electrical contacts of said set of electrical contacts of each of said electronic devices to be respectively connected to the other; and
applying sufficient loading force to said electronic devices so as to cause said rigid conductive metal columns to make conductive contact with each of the electrical contacts of said electronic devices to be connected with said loading force sufficient to cause more than one of said conductive metal columns to form indentations into each of said solder ball contacts of said at least one of said electronic devices.
1 Assignment
0 Petitions
Accused Products
Abstract
An electrical connector or interposer for making connection in a high density device electronic environment. The connector is made of a high density array of nickel columns held in a layer of polyimide with each column extending beyond the opposing surfaces of said layer of polyimide. The connector may be used to make temporary or permanent connection to electrical contacts without alignment. Connection may be accomplished by loading forces sufficient to form either an indentation or a penetration of solder ball contacts. Contact to a single chip or a full wafer of chips is facilitated for testing.
48 Citations
7 Claims
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1. A method of making electrical connection between electronic devices each having a set of electrical contacts to be respectively connected to the other with the set of electrical contacts of at least one of said electronic devices being solder ball contacts, comprising:
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positioning in both the X and Y directions a uniform array of rigid conductive metal columns orthogonal to a plane between said devices with each of said conductive metal columns of said array of conductive metal columns being parallel to one another and no more than 25 microns in diameter and 50 microns apart and electrically insulated from one another and held in a layer of material so as to extend beyond each of the opposing surfaces thereof with the spacing between said conductive metal columns sufficient to cause more than one conductive metal column of said array of conductive metal columns to align with each of the electrical contacts of said set of electrical contacts of each of said electronic devices to be respectively connected to the other; and
applying sufficient loading force to said electronic devices so as to cause said rigid conductive metal columns to make conductive contact with each of the electrical contacts of said electronic devices to be connected with said loading force sufficient to cause more than one of said conductive metal columns to form indentations into each of said solder ball contacts of said at least one of said electronic devices. - View Dependent Claims (2, 3, 4, 5)
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6. A high density Z-Axis connector for interconnecting respective arrays of opposing electrical contacts on a pair of electronic devices with at least one of said respective arrays of electrical contacts being solder ball contacts on a wafer, comprising:
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a thin layer of insulating material having an area at least as large as said wafer; and
a two-dimensional array of equally spaced rigid metal columns formed in said layer of insulating material parallel to one another and orthogonal to the surfaces of said layer of insulating material with each of said metal columns being no more than 25 microns in diameter and 50 microns apart and uniformly extending beyond each of the opposing surfaces of said layer of insulating material so that a plurality of metal columns form indentations into each of said solder balls under load. - View Dependent Claims (7)
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Specification