Composition and method for priming substrate materials
First Claim
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1. A method of preparing a primed substrate, comprising:
- obtaining a solution comprising from about 0.003% to about 3.0% of a film forming amine and sufficient acid to produce a pH of less than about 6.5;
coating at least a portion of the substrate with the solution, thereby forming a hydrophobic film comprising an amine on the outer surface of the substrate; and
forming a second coating on the hydrophobic film.
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Abstract
The formulation primes materials used in the processing of substrates. The formulation comprises one or more filming amines which are mixed with and neutralized by an appropriate acid or combination of acids. Water is used as the solvent and a surfactant is optionally added to aid in the cleaning, anti-foaming and wetting of the substrates. Printed circuit boards, chemically milled alloys and chemically plated alloys can be coated with the formulation as a one-step priming method prior to lamination of a resist layer.
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Citations
14 Claims
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1. A method of preparing a primed substrate, comprising:
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obtaining a solution comprising from about 0.003% to about 3.0% of a film forming amine and sufficient acid to produce a pH of less than about 6.5;
coating at least a portion of the substrate with the solution, thereby forming a hydrophobic film comprising an amine on the outer surface of the substrate; and
forming a second coating on the hydrophobic film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification