Copper interconnect structure and method of formation
First Claim
1. A method for forming a copper interconnect structure within a semiconductor device comprising the steps of:
- providing a semiconductor substrate;
forming a first dielectric layer overlying the semiconductor substrate;
patterning the first dielectric layer to form a first opening and a second opening within the first dielectric layer;
forming a copper layer, the copper layer lying within the first opening and the second opening;
removing a portion of the copper layer to form a first copper interconnect within the first opening and a second copper interconnect within the second opening;
exposing a portion of the first copper interconnect and a portion of the second copper interconnect to a plasma consisting essentially of hydrogen and nitrogen;
forming a first silicon oxynitride layer overlying the first copper interconnect and the second copper interconnect after the step of exposing the first copper interconnect and the second copper interconnect to the plasma, the first silicon oxynitride layer having a first absorptive coefficient;
forming a second silicon oxynitride layer abutting the first silicon oxynitride layer, the second silicon oxynitride layer having a second absorptive coefficient;
forming a second dielectric layer overlying the second silicon oxynitride layer;
forming a photoresist mask overlying the second dielectric layer, wherein the photoresist mask is formed using electromagnetic radiation, the electromagnetic radiation having an exposure wavelength, wherein the first absorptive coefficient is less than the second absorptive coefficient at the exposure wavelength; and
using the photoresist mask to pattern the second dielectric layer.
10 Assignments
0 Petitions
Accused Products
Abstract
In one embodiment, a copper interconnect structure is formed by depositing a dielectric layer (28) on a semiconductor substrate (10). The dielectric layer (28) is then patterned to form interconnect openings (29). A layer of copper (34) is then formed within the interconnect openings (29). A portion of the copper layer (34) is then removed to form copper interconnects (39) within the interconnect openings (29). A copper barrier layer (40) is then formed overlying the copper interconnects (39). Adhesion between the copper barrier layer (40) and the copper interconnects (39) is improved by exposing the exposed surface of the copper interconnects (39) to a plasma generated using only ammonia as a source gas.
-
Citations
13 Claims
-
1. A method for forming a copper interconnect structure within a semiconductor device comprising the steps of:
-
providing a semiconductor substrate;
forming a first dielectric layer overlying the semiconductor substrate;
patterning the first dielectric layer to form a first opening and a second opening within the first dielectric layer;
forming a copper layer, the copper layer lying within the first opening and the second opening;
removing a portion of the copper layer to form a first copper interconnect within the first opening and a second copper interconnect within the second opening;
exposing a portion of the first copper interconnect and a portion of the second copper interconnect to a plasma consisting essentially of hydrogen and nitrogen;
forming a first silicon oxynitride layer overlying the first copper interconnect and the second copper interconnect after the step of exposing the first copper interconnect and the second copper interconnect to the plasma, the first silicon oxynitride layer having a first absorptive coefficient;
forming a second silicon oxynitride layer abutting the first silicon oxynitride layer, the second silicon oxynitride layer having a second absorptive coefficient;
forming a second dielectric layer overlying the second silicon oxynitride layer;
forming a photoresist mask overlying the second dielectric layer, wherein the photoresist mask is formed using electromagnetic radiation, the electromagnetic radiation having an exposure wavelength, wherein the first absorptive coefficient is less than the second absorptive coefficient at the exposure wavelength; and
using the photoresist mask to pattern the second dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method for forming a semiconductor device comprising the steps of:
-
providing a semiconductor substrate;
forming a first copper interconnect and a second copper interconnect overlying the semiconductor substrate;
exposing a portion of the first copper interconnect and a portion of the second copper interconnect to a plasma consisting essentially of hydrogen and nitrogen;
forming a silicon nitride layer overlying the first copper interconnect and the second copper interconnect after the step of exposing the first copper interconnect and the second copper interconnect to the plasma, the silicon nitride layer having a first absorptive coefficient;
forming a silicon oxynitride layer abutting the silicon nitride layer, the silicon oxynitride layer having a second absorptive coefficient;
forming a dielectric layer overlying the silicon oxynitride layer;
forming a photoresist mask overlying the dielectric layer, wherein the photoresist mask is formed using electromagnetic radiation, the electromagnetic radiation having an exposure wavelength wherein the first absorptive coefficient is less than the second absorptive coefficient at the exposure wavelength; and
using the photoresist mask to pattern the dielectric layer. - View Dependent Claims (9, 10, 11, 12, 13)
-
Specification