Electroluminescence device, electroluminescence apparatus, and production methods thereof

• US 6,175,345 B1
• Filed: 05/28/1998
• Issued: 01/16/2001
• Est. Priority Date: 06/02/1997
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Tsuzuki, Hidetoshi, Ueno, Kazunori, Kuribayashi, Masaki, Senoo, Akihiro, Hashimoto, Yuichi
• Primary Examiner(s): Shankar, Vijay
• Assistant Examiner(s): PIZIALI, JEFFREY J
• Application Number:
  US09/084,994
• Time in Patent Office: 964 Days
• Field of Search: 345/33-36, 345/44-45, 345/55, 345/92, 345/76-81, 315/169.3, 313/500-520, 257/59, 257/448, 349/42
• US Class Current: 345/76
• CPC Class Codes: G09G 2300/0426 Layout of electrodes and connections
• CPC Class Codes: G09G 2300/0842 forming a memory circuit, e.g. a dynamic memory with one capacitor
• CPC Class Codes: G09G 2300/0861 with additional control of the display period without amending the charge stored in a pixel memory, e.g. by means of additional select electrodes
• CPC Class Codes: G09G 2300/0895 having more than one selection line for a two-terminal active matrix LCD, e.g. Lechner and D2R circuits
• CPC Class Codes: G09G 2310/0224 Details of interlacing
• CPC Class Codes: G09G 2310/0256 with the purpose of reversing the voltage across a light emitting or modulating element within a pixel
• CPC Class Codes: G09G 2310/06 Details of flat display driving waveforms
• CPC Class Codes: G09G 2320/043 Preventing or counteracting the effects of ageing
• CPC Class Codes: G09G 3/3233 with pixel circuitry controlling the current through the light-emitting element
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10K 50/854 comprising scattering means
• CPC Class Codes: H10K 59/1275 Electrical connections of the two substrates
• CPC Class Codes: H10K 59/87 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 71/841 Applying alternating current [AC] during manufacturing or treatment

Abstract

An electroluminescence device having a transistor substrate comprising drain electrode pads, each being connected to a drain of a thin film transistor, and capacitors connected to the respective drain electrode pads, and an electroluminescence substrate comprising pairs of electrodes and electroluminescence members each provided between a pair of electrodes, arranged along a plurality of rows and columns, wherein the thin film transistor substrate and the electroluminescence substrate are placed opposite to each other so that the drain electrode pads and the electroluminescence members are opposed to each other, and wherein each drain electrode pad and one electrode of a pair of electrodes are connected through an adhesive electric connection member.

Claims

1. An electroluminescence device having a transistor substrate comprising a first substrate, thin film transistors arranged along a plurality of rows and columns on said first substrate, gate lines provided for the respective rows on said first substrate, each gate line being a common line for connecting gates of thin film transistors on one of the rows, source lines provided for the respective columns, each source line being a common line for connecting sources of thin film transistors on one of the columns on said first substrate, drain electrode pads each connected to a drain of the respective thin film transistors on said first substrate, and capacitors connected to the respective drain electrode pads on said first substrate;

and an electroluminescence substrate comprising a second substrate, pairs of electrodes and electroluminescence members interposed between the pairs of electrodes on said second substrate, which are arranged along a plurality of rows and columns, wherein said thin film transistor substrate and electroluminescence substrate are placed opposite to each other so that the drain electrode pads and the electroluminescence members are opposed to each other, and wherein each drain electrode pad is connected through an adhesive electric connection member to one of a pair of electrodes of said electroluminescence member.

2. The electroluminescence device according to claim 1, wherein said electroluminescence members comprise media that emit the three primary colors of blue, green and red.

3. The electroluminescence device according to claim 1, wherein said electroluminescence members comprise media of organic substance that emit the three primary colors of blue, green and red.

4. The electroluminescence device according to claim 1, wherein said adhesive electric connection member is a material in which electrically conductive particles are dispersed in an adhesive.

5. The electroluminescence device according to claim 1, wherein said adhesive electric connection member is a material in which electrically conductive particles are dispersed in an adhesive and which contains a silane coupling agent.

6. The electroluminescence device according to claim 1, wherein an electric insulator is disposed around the periphery of said adhesive electric connection member.

7. The electroluminescence device according to claim 1, wherein an adhesive electric insulator is disposed around the periphery of said adhesive electric connection member.

8. The electroluminescence device according to claim 1, wherein an electric insulator containing a coloring agent is disposed around the periphery of said adhesive electric connection member.

9. The electroluminescence device according to claim 1, wherein an electric insulator of a liquid form is disposed around the periphery of said adhesive electric connection member.

10. The electroluminescence device according to claim 1, wherein said thin film transistors have a polysilicon semiconductor layer.

11. The electroluminescence device according to claim 1, wherein said thin film transistors have an amorphous silicon semiconductor or a microcrystalline silicon semiconductor.

12. The electroluminescence device according to claim 1, wherein said thin film transistors have a crystal silicon semiconductor.

13. The electroluminescence device according to claim 1, wherein at least one electrode out of the pair of electrodes on either side of each said electroluminescence member is a transparent electrode having the texture structure.

14. The electroluminescence device according to claim 1, wherein at least one electrode out of the pair of electrodes on either side of each said electroluminescence member is a transparent electrode of ZnO having the texture structure.

15. An electroluminescence device having a transistor substrate comprising a first substrate, first thin film transistors arranged along a plurality of rows and columns on said first substrate, gate lines provided for the respective rows on said first substrate, each gate line being a common line for connecting gates of first thin film transistors on one of the rows, source lines provided for the respective columns on said first substrate, each source line being a common line for connecting sources of first thin film transistors on one of the columns, second thin film transistors each connected to a drain of the respective first thin film transistors on said first substrate, and capacitors connected to the respective second thin film transistors on said first substrate, wherein a gate of each second thin film transistor is connected to the drain of the first thin film transistor, a drain electrode pad is connected to a drain of each second thin film transistor, and a source of each second thin film transistor is connected to one electrode of the capacitor;

and an electroluminescence substrate comprising a second substrate, pairs of electrodes and electroluminescence members interposed between the pairs of electrodes on said second substrate, which are arranged along a plurality of rows and columns, wherein said thin film transistor substrate and electroluminescence substrate are placed opposite to each other so that the drain electrode pads and the electroluminescence members are opposed to each other, and wherein each drain electrode pad is connected through an adhesive electric connection member to one of a pair of electrodes of said electroluminescence member.

16. The electroluminescence device according to claim 15, wherein said electroluminescence members comprise media that emit the three primary colors of blue, green and red.

17. The electroluminescence device according to claim 15, wherein said electroluminescence members comprise media of organic substance that emit the three primary colors of blue, green and red.

18. The electroluminescence device according to claim 15, wherein said adhesive electric connection member is a material in which electrically conductive particles are dispersed in an adhesive.

19. The electroluminescence device according to claim 15, wherein said adhesive electric connection member is a material in which electrically conductive particles are dispersed in an adhesive and which contains a silane coupling agent.

20. The electroluminescence device according to claim 15, wherein an adhesive electric insulator is disposed around the periphery of said adhesive electric connection member.

21. The electroluminescence device according to claim 15, wherein said thin film transistors have a polysilicon semiconductor layer.

22. The electroluminescence device according to claim 15, wherein said thin film transistors have an amorphous silicon semiconductor or a microcrystalline silicon semiconductor.

23. The electroluminescence device according to claim 15, wherein said thin film transistors have a crystal silicon semiconductor.

24. A production method of electroluminescence device comprising steps of:

preparing a transistor substrate comprising a first substrate, thin film transistors arranged along a plurality of rows and columns on said first substrate, gate lines provided for the respective rows on said first substrate, each gate line being a common line for connecting gates of thin film transistors on one of the rows, source lines provided for the respective columns on said first substrate, each source line being a common line for connecting sources of thin film transistors on one of the columns, drain electrode pads each connected to a drain of the respective thin film transistors on said first substrate, and capacitors connected to the respective drain electrode pads on said first substrate;

preparing an electroluminescence substrate comprising a second substrate, pairs of electrodes and electroluminescence members interposed between the pairs of electrodes on said second substrate, which are arranged along a plurality of rows and columns;

placing an adhesive electric connection member on at least one of the drain electrode pads of the transistor substrate and the electroluminescence members; and

overlaying the thin film transistor substrate on the electroluminescence substrate opposite to each other so that the drain electrode pads and the electroluminescence members are opposed to each other.

25. The production method of electroluminescence device according to claim 24, wherein said electroluminescence members comprise media that emit the three primary colors of blue, green and red.

26. The production method of electroluminescence device according to claim 24, wherein said electroluminescence members comprise media of organic substance that emit the three primary colors of blue, green and red.

27. The production method of electroluminescence device according to claim 24, wherein said adhesive electric connection member is a material in which electrically conductive particles are dispersed in an adhesive.

28. The production method of electroluminescence device according to claim 27, wherein said adhesive electric connection member is a material in which the electrically conductive particles are dispersed in the adhesive and which contains a silane coupling agent.

29. A production method of electroluminescence device comprising steps of:

preparing a transistor substrate comprising a first substrate, thin film transistors arranged along a plurality of rows and columns on said first substrate, gate lines provided for the respective rows on said first substrate, each gate line being a common line for connecting gates of thin film transistors on one of the rows source lines provided for the respective columns on said first substrate, each source line being a common line for connecting sources of thin film transistors on one of the columns, drain electrode pads each connected to a drain of the respective thin film transistors on said first substrate, and capacitors connected to the respective drain electrode pads on said first substrate;

preparing an electroluminescence substrate comprising a second substrate, pairs of electrodes and electroluminescence members interposed between the pairs of electrodes on said second substrate, which are arranged along a plurality of rows and columns;

placing an adhesive electric connection member on at least one of the drain electrode pads of the transistor substrate and the electroluminescence members;

placing an adhesive electric insulator around the periphery of the adhesive electric connection member on at least one of the drain electrode pads of the transistor substrate and the electroluminescence members; and

overlaying the thin film transistor substrate on the electroluminescence substrate opposite to each other so that the drain electrode pads and the electroluminescence members are opposed to each other.

30. A production method of electroluminescence device comprising steps of:

preparing a transistor substrate comprising a first substrate, thin film transistors arranged along a plurality of rows and columns on said first substrate, gate lines provided for the respective rows on said first substrate, each gate line being a common line for connecting gates of thin film transistors on one of the rows, source lines provided for the respective columns on said first substrate, each source line being a common line for connecting sources of thin film transistors on one of the columns, drain electrode pads each connected to a drain of the respective thin film transistors on said first substrate, and capacitors connected to the respective drain electrode pads on said first substrate;

preparing an electroluminescence substrate comprising a second substrate, pairs of electrodes and electroluminescence members interposed between the pairs of electrodes on said second substrate, which are arranged along a plurality of rows and columns;

placing an adhesive electric connection member on at least one of the drain electrode pads of the transistor substrate and the electroluminescence members;

placing an adhesive electric insulator around the periphery of the adhesive electric connection member on at least one of the drain electrode pads of the transistor substrate and the electroluminescence members;

overlaying the thin film transistor substrate on the electroluminescence substrate opposite to each other so that the drain electrode pads and the electroluminescence members are opposed to each other; and

evacuating a space between the thin film transistor substrate and the electroluminescence substrate and heating the adhesive electric connection member and adhesive electric insulator to cure said member and insulator.