Surface mount thermal connections

• US 6,175,500 B1
• Filed: 09/22/1998
• Issued: 01/16/2001
• Est. Priority Date: 09/22/1998
• Status: Expired due to Term

• Current Assignee: ABB Power Electronics Inc. (ABB Ltd.)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Roy, Apurba
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US09/158,671
• Time in Patent Office: 847 Days
• Field of Search: 228/179, 228/180.21, 228/180.22, 257/718, 257/719, 257/727, 174/16.3, 174/252, 174/255, 174/261, 165/80.3, 165/185, 298/32, 298/40, 361/704, 361/722, 361/717-720, 361/767, 361/768
• US Class Current: 361/719
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10204 Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.

Claims

1. Apparatus for removing heat from a substrate supporting heat generating components comprising:

substrate having a surface populated by heat generating components, the surface having positions thereon subject to greatest heat accumulation;

a plurality of solder bonding pads on said surface located at a plurality of said positions;

a plurality of solid metal bodies without internal cavities, each body having a height greater than the height of said components, a length dimension greater than the height and having a bonding surface including the length dimension bonded to said bonding pads; and

a thermal plane overlying the substrate surface and in thermal contact with said bodies, whereby said bodies remove heat from said substrate surface by conducting it to said thermal plane.

2. Apparatus according to claim 1 wherein the bonding surfaces of said bodies are bifurcated by recessed regions.

3. Apparatus according to claim 1 wherein said substrate is an electrically insulating substrate and said heat-generating components are electrical or electronic circuit components.

4. Apparatus according to claim 1 wherein said bodies comprise copper.

5. Apparatus according to claim 1 wherein said bodies are rectangular parallelpipeds.