Pressure sensor

• US 6,176,137 B1
• Filed: 03/04/1999
• Issued: 01/23/2001
• Est. Priority Date: 04/09/1998
• Status: Expired due to Fees

• Current Assignee: Fujikoki Corporation
• Original Assignee: Fujikoki Corporation
• Inventors: Miyano, Jun-ichi, Sawada, Akira, Sasaki, Keiji
• Primary Examiner(s): Fuller, Benjamin R.
• Assistant Examiner(s): AW MUSSE, ABDULLAHI H
• Application Number:
  US09/262,067
• Time in Patent Office: 691 Days
• Field of Search: 737/00, 737/15, 737/21, 737/27, 737/28, 737/54, 737/56
• US Class Current: 73/754
• CPC Class Codes: G01L 19/0038 being part of the housing other details about the housing G01L19/14
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A pressure sensor 1 comprises a metallic housing 10 having a space 18 communicated to a pressure detection space and a thin rising portion 17 formed on the upper end of the peripheral area, a sensor element 20, a sensor element holder 30, a metallic pressure case 60 having a ceiling portion 61, and a connector case 70 formed of an insulating material, wherein a collar portion 211 of a base plate 21 of the sensor element 20 including a pressure sensing element 22 is contacted to an annular protrusion 33 positioned around the opening 32 of the sensor element holder 30, and the collar portion 211 is airtightly welded to the annular protrusion 33 by projection welding. Further, the collar portion 63 on the pressure case 60 and the peak surface 35 of the holder 30 is airtightly welded by an electron beam welding. The airtight interior space defined by the sensor element 20, the sensor element holder 30 and the pressure case 60 is utilized as the reference pressure space.

Claims

1. A pressure sensor for sensing pressure comprising:

a sensor element formed of a semiconductor element having a piezoresistance effect;

a base plate for mounting said sensor element;

a holder to which said sensor element is airtightly fixed using said base plate;

a pressure case to which said holder is airtightly fixed, said pressure case having an electromagnetic shield function and forming a reference pressure space by covering said sensor element; and

a housing having a pressure introducing hole supporting said holder,

wherein said base plate has a collar portion which is connected by welding to said holder.

2. The pressure sensor as recited in claim 1, wherein said reference gas comprises helium gas or nitrogen gas.

3. The pressure sensor as recited in claim 1, wherein said reference pressure space is kept in a vacuum state.

4. The pressure sensor as recited in claim 1, wherein said holder has a central aperture, and said base plate and a peripheral area of said aperture area are connected by welding.

5. The pressure sensor as recited in claim 1, wherein said holder has a central aperture, and said collar portion and a peripheral area of said aperture are connected by welding.

6. The pressure sensor as recited in any one of claims 4 or 5, wherein said welding is projection welding.

13. The pressure sensor as recited in claim 1, claim 7 or claim 10, wherein said pressure case is equipped with an airtight penetrating condenser, and said penetrating condenser guides the output from said sensor element to a predetermined exterior terminal.

14. A pressure sensor according to claim 1, claim 7 or claim 10, wherein said pressure case is equipped with an airtight penetrating condenser, and said penetrating condenser is positioned inside said reference pressure space and being connected to a circuit board for converting the output from said sensor element to a PWM signal.

7. A pressure sensor comprising:

a housing having a pressure introducing hole;

a sensor element formed of a semiconductor element having a piezoresistance effect;

a holder to which said sensor element is fixed; and

a pressure case having a ceiling portion, said sensor element, said holder and said pressure case being welded air tightly together to form a reference pressure space,

wherein said sensor element is formed by mounting said semiconductor element on a metallic base plate having a first collar portion through an upper base and a lower base,

said holder includes an opening formed in a center portion thereof, an annular protrusion positioned surrounding said opening at a lower surface thereof, and a flat surface formed on a peak surface of a rising portion formed around said holder,

said pressure case includes a second collar portion where a lower end of a surrounding wall hanging from said ceiling portion is bent outwardly,

said base plate of said sensor element is welded and fixed airtightly to said annular protrusion of said holder, and

said second collar portion of said pressure case is welded and fixed airtightly to said peak surface of said holder.

8. The pressure sensor as recited in claim 7, wherein said reference pressure space comprises helium gas or nitrogen gas.

9. The pressure sensor as recited in claim 7, wherein said reference pressure space is kept in a vacuum state.

10. A pressure sensor comprising:

a metallic housing having a pressure introducing hole;

a sensor element formed of a semiconductor element having a piezoresistance effect;

a holder to which said sensor element is airtightly fixed; and

a metallic pressure case having a ceiling portion, said sensor element, said holder and said pressure case being welded airtightly together to form a reference pressure space,

wherein said sensor element is formed by mounting said semiconductor element on a metallic base plate having a first collar portion through an upper base and a lower base,

said holder comprises an interior space, an opening formed in a center portion thereof, an annular protrusion positioned surrounding said opening at a lower surface thereof, and a flat surface formed on a peak surface of the rising portion formed around said holder,

said pressure case comprises a second collar portion where a lower end of a surrounding wall hanging from a peripheral of said ceiling portion is bent outwardly,

said base plate is welded and fixed airtightly to said annular protrusion of said holder, and

said second collar portion of said pressure case is welded and fixed airtightly to said peak surface of said holder.

11. The pressure sensor as recited in claim 10, wherein said reference pressure space comprises helium gas or nitrogen gas.

12. The pressure sensor as recited in claim 10, wherein said reference pressure space is kept in a vacuum state.

15. A pressure sensor comprising:

a sensor element formed of a semiconductor element having a piezoresistance effect, said sensor element being mounted on a base plate;

a housing for introducing pressure to said sensor element; and

a holder for airtightly supporting said sensor element, said holder being supported by said housing,

wherein said base plate has a collar portion which is connected by welding to said holder.

16. The pressure sensor as recited in claim 15, wherein said holder has a central aperture, and said base plate and a peripheral area of said aperture area are connected by welding.

17. The pressure sensor as recited in claim 15, wherein said holder has a central aperture, and said collar portion and a peripheral area of said aperture are connected by welding.

18. The pressure sensor as recited in any one of claims 16 and 17, wherein said welding is projection welding.

19. A pressure sensor comprising:

a sensor element formed of a pressure sensing element, a base, and a base plate;

a holder for supporting said sensor element; and

a housing for supporting said holder, said housing having a pressure introducing hole,

wherein said base plate of said sensor element is welded airtightly to said holder, and

said base plate has a collar portion which is connected by welding to said holder.

20. The pressure sensor as recited in claim 19, wherein said holder has a central aperture, and said base plate and a peripheral area of said aperture area are connected by welding.

21. The pressure sensor as recited in claim 19, wherein said holder has a central aperture, and said collar portion and a peripheral area of said aperture are connected by welding.

22. The pressure sensor as recited in any one of claims 20 and 21, wherein said welding is projection welding.

23. A pressure sensor comprising:

a housing having a pressure introducing hole;

a sensor element having a pressure sensing element; and

a holder for supporting said sensor element,

wherein said sensor element is formed by mounting said semiconductor element on a metallic base plate having a collar portion through an upper base and a lower base,

said holder comprises an opening formed in a center portion thereof and an annular protrusion positioned surrounding said opening at a lower surface thereof, and

said base plate of said sensor element is welded and fixed airtightly to said annular protrusion of said holder.

24. A pressure sensor comprising:

a sensor element formed of a pressure sensing element, a base and a base plate; and

a holder for supporting said sensor element,

wherein said base plate has a collar portion which is connected by welding to said holder,

said base plate of said sensor element is welded and fixed airtightly to said holder,

said holder is welded and fixed airtightly to a pressure case having an electromagnetic shield function and forming a reference pressure space by covering said sensor element, said holder being further supported by a housing having a pressure introducing hole.

25. A pressure sensor according to claim 24, wherein a predetermined gas is sealed inside said reference pressure space.

26. The pressure sensor as recited in claim 24, wherein said reference pressure space comprises helium gas or nitrogen gas.

27. The pressure sensor as recited in claim 24, wherein said reference pressure space is kept in a vacuum state.

32. A pressure sensor according to either of claims 24, 28 or 29, wherein said pressure case is airtightly equipped with a penetrating condenser having electrodes mounted on the inner and outer surfaces of a pipe-like dielectric, and the output from said sensor element is guided to a predetermined exterior terminal by being penetrated through said penetrating condenser.

33. A pressure sensor according to either of claims 24, 28 or 29, wherein said pressure case is airtightly equipped with a penetrating condenser having electrodes mounted on the inner and outer surfaces of a pipe-like dielectric, the output from said sensor element being guided to a predetermined exterior terminal by being penetrated through said penetrating condenser, and a bypassing condenser is connected in parallel relation with said penetrating condenser, the other end of said bypassing condenser being connected to said pressure case.

28. A pressure sensor comprising:

a housing having a pressure introducing hole;

a sensor element having a pressure sensing element formed of a semiconductor element;

a holder to which said sensor element is fixed; and

a pressure case having a ceiling portion, said sensor element, said holder and said pressure case being welded airtightly together to form a reference pressure space,

wherein said sensor element is formed by mounting said semiconductor element on a metallic base plate having a first collar portion through an upper base and a lower base,

said holder comprises an opening formed in a center portion thereof, an annular protrusion positioned surrounding said opening at a lower surface thereof, and a flat surface formed on a upper surface thereof,

said pressure case comprises a second collar portion where a lower end of a surrounding wall hanging from said ceiling portion is bent outwardly, and an annular protrusion is formed on a surface opposing said holder,

said base plate of said sensor element is welded and fixed airtightly to said annular protrusion of said holder, and

said annular protrusion formed on a second collar portion of said pressure case is welded and fixed airtightly to said flat surface of said holder.

29. A pressure sensor comprising:

a housing having a pressure introducing hole;

a sensor element having a pressure sensing element formed of a semiconductor element;

a holder for supporting said sensor element; and

a pressure case having a ceiling portion, said sensor element, said holder and said pressure case being welded airtightly together to form a reference pressure space,

wherein said sensor element is formed by mounting said semiconductor element on a metallic plate having a first collar portion through an upper base and a lower base,

said holder comprises an opening formed on a center portion thereof, an annular protrusion positioned surrounding said opening at a lower surface thereof, and an annular protrusion positioned opposing said pressure case,

said pressure case comprises a second collar portion where a lower end of a surrounding wall hanging from a peripheral of said ceiling portion is bent outwardly,

said base plate of said sensor element is welded and fixed airtightly to said annular protrusion positioned on a lower surface of said holder, and

said second collar portion of said pressure case is welded and fixed airtightly to said annular protrusion on said holder positioned opposing said pressure case.

30. The pressure sensor as recited in claim 29, wherein said reference pressure space comprises helium gas or nitrogen gas.

31. The pressure sensor as recited in claim 29, wherein said reference pressure space is kept vacuum.