Inspection of ball grid arrays (BGA) by using shadow images of the solder balls

• US 6,177,682 B1
• Filed: 10/21/1998
• Issued: 01/23/2001
• Est. Priority Date: 10/21/1998
• Status: Expired due to Fees

• Current Assignee: Novacam Technologies, Inc.
• Original Assignee: Novacam Technologies, Inc.
• Inventors: Zacek, Gabriele, Bartulovic, Vuk, Lucic, Miljenko
• Primary Examiner(s): LE, QUE TAN
• Application Number:
  US09/176,249
• Time in Patent Office: 825 Days
• Field of Search: 250/559.44, 250/559.22, 250/559.4, 250/559.19, 250/559.12, 250/559.29, 250/559.3, 250/208.1, 356/237.4, 356/237.5, 356/376, 382/150, 382/149, 382/151, 257/738, 257/779, 257/780
• US Class Current: 250/559.44
• CPC Class Codes: G01N 21/951 Balls

Abstract

A method for measuring such parameters as height, position, shape, colinearity, and coplanarity of arrays of minute objects on the surface of integrated circuits, such as Ball Grid Arrays (BGA), all in one simple and straight forward procedure during the manufacturing process of integrated circuits. Shadows of the objects are created on the substrate through the use of x-rays or other light sources placed at predetermined distances and angles from the objects. An imaging device obtains images from the shadows cast onto the substrate and the images are then analyzed to determine if they meet predefined parameters. Multiple sources of illumination can be used to illuminate the array in order to create a more precise image for analysis and three dimensional images of the BGA can be created for analysis.

Claims

1. A system for inspecting a ball grid array on an integrated circuit for verifying if said array conforms to specific position parameters, the system comprising:

a source of electromagnetic radiation projected at a predetermined angle onto a substrate of the integrated circuit on which substrate surface is said array;

an imaging device to obtain an image of shadows cast by balls of the ball grid array; and

an image analysis engine to analyze said image to obtain contour data of the shadows cast by the balls.

2. The system of claim 1 wherein the system comprises further an inspection criteria decision logic unit to analyze said contour data to obtain ball position or dimensional data to determine if a position or dimension of said balls meet certain predefined parameters whereby the system can verify if the balls meet these predefined parameters.

3. The system of claim 1 wherein the electromagnetic radiation projected onto the substrate, on which said array is located, to create the shadows is selected from the group consisting of x-rays and light.

4. The system of claim 1 wherein the predetermined angle is the angle at which an axis of illumination of the electromagnetic source strikes the substrate on which the ball grid array is located and that angle is selected from any angle between 10 to 40 degrees;

and wherein the balls of the ball grid array form an orthogonal grid array structure with a primary axis on the substrate of the integrated circuit and an angle on the substrate which a projection onto the substrate of the axis of illumination makes with the primary axis of the orthogonal grid structure can be selected from any angle between 5 to 40 degrees.

5. The system of claim 1 further comprising a second source of electromagnetic radiation with an axis of illumination parallel to an optical axis of the imaging device, the axis of both being perpendicular to the substrate, whereby the system can compare images obtained by the imaging device with radiation generated by the source of electromagnetic radiation set at the predetermined angle with images obtained by the second source of electromagnetic radiation and thereby obtain a sharper definition of the shadows cast by illumination with the source set at the predetermined angle.

6. The system of claim 1 wherein the source of electromagnetic radiation provides illumination of the integrated circuit at the predetermined angle to the substrate from at least two different directions so that at least two different shadows of each ball of the array are provided for analysis.

7. The system of claim 6 wherein two separate images are taken by the imaging device one from each of the at least two different directions.

8. The system of claim 6 wherein the imaging device takes one image with illumination provided from the at least two different directions at the same time.

9. The system of claim 6 wherein the at least two different directions are at equidistant angles from each other.

10. The system of claim 6 wherein illumination of the integrated circuit at the predetermined angle to the substrate from at the at least two different directions further comprises illuminating the array from four different directions at the predetermined angle and wherein the four different directions are positioned at equidistant angles from each other.

11. The system of claim 6 wherein the illumination of the array from at least two different directions at the same predetermined angle provides data to construct a three dimensional image of the of the balls of the array for analysis.

12. The system of claim 6 wherein the system uses the images obtained to produce a three dimensional image for analysis.

13. The system of claim 1 wherein the imaging device comprises at least two imaging devices to image the ball grid array from at least two different directions whereby the data so obtained can be used by the system to produce three dimensional images of the array.

14. The system of claim 2 wherein the predefined parameters are selected from a group of:

coplanarity, colinearity, ball shape analysis, and warpage.

15. A method for verifying that an array of minute objects on a workpiece conform to specific parameters, said method comprising:

projecting electromagnetic radiation at a predetermined angle onto a substrate surface of the workpiece on which substrate surface are positioned an array of minute objects;

imaging the shadows cast by the minute objects as a result of being illuminated by the electromagnetic radiation;

analyzing the images so obtained to determine if the array of minute objects meet certain predefined parameters.

16. The method of claim 15 wherein projecting electromagnetic radiation at a predetermined angle onto the substrate surface of the workpiece comprises projecting it so that an axis of illumination of the radiation so projected intersects the substrate surface at an angle selected from any angle between 10 and 40 degrees.

17. The method of claim 15 wherein projecting electromagnetic radiation further comprises projecting it so that a projection of a path of the axis of illumination onto the substrate surface forms, with a primary axis of an orthogonal grid structure of the ball grid array on the substrate, an angle selected from any angle between 5 to 40 degrees.

18. The method of claim 15 wherein projecting electromagnetic radiation at a predetermined angle onto the substrate surface of the workpiece further comprises projecting such radiation from at least two different directions but at the same predetermined angle so that at least two shadows are cast by each object of the grid array.

19. The method of claim 17 wherein the step of projecting radiation further comprises projecting radiation from the at least two different directions at equidistant angles from each other.

20. The method of claim 18 comprising the additional step of creating a three dimensional representation of the minute objects located on the substrate from the images obtained.

21. The method of claim 15 wherein the step of imaging the substrate with the minute objects thereon further comprises imaging it from at least two different directions so that from the data obtained three dimensional representations of the minute objects on the substrate can be created.

22. The method of claim 15 where in the step of projecting radiation comprises generating radiation selected form the group of x-rays and light.

23. The method of claim 15 wherein the predefined parameters are selected from a group of:

coplanarity, colinearity, ball shape analysis, and warpage.

24. A system for verifying that an array of minute objects on a workpiece conform to specific parameters, the system comprising:

a source of electromagnetic radiation projected at a predetermined angle onto a substrate of the work piece on which substrate surface are an array of minute objects,

an imaging device to image the shadows cast by the minute objects,

an image analysis engine to analyze the shadows cast to determine if the minute objects and substrate meet certain predefined parameters.

25. The system of claim 24 wherein the predefined parameters are selected from a group of:

coplanarity, colinearity, ball shape analysis, and warpage.