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Discharge gap device and its mounting structure

  • US 6,178,078 B1
  • Filed: 11/12/1998
  • Issued: 01/23/2001
  • Est. Priority Date: 11/12/1997
  • Status: Expired due to Term
First Claim
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1. A discharge gap device adapted to be mounted on a printed circuit board (PCB), comprising:

  • a dielectric having two opposing surfaces;

    at least two lead wires each having a portion adapted to be attached to the printed circuit board and another portion attached to one surface of said dielectric;

    at least two conductors which are connected to said lead wires and provided on said one surface of said dielectric; and

    a resistor connected between said two lead wires in parallel with said discharge gap device without being directly attached to said at least two conductors or directly mounted on said dielectric, the other surface of said dielectric being free of conductive material to avoid shunting capacitance being formed across said at least two conductors and to prevent passage of high frequency components across the gap device, wherein upon application of over-voltage, discharge is caused to occur between said conductors.

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