Apparatus and method for direct attachment of heat sink to surface mount

• US 6,178,628 B1
• Filed: 09/11/1998
• Issued: 01/30/2001
• Est. Priority Date: 10/22/1997
• Status: Expired due to Fees

• Current Assignee: Aavid Thermalloy LLC (LTI Flexible Products Inc.)
• Original Assignee: Aavid Thermalloy LLC (LTI Flexible Products Inc.)
• Inventors: Mellinger, Mark, Clemens, Donald L., Kuzmin, Gary
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US09/151,927
• Time in Patent Office: 872 Days
• Field of Search: 298/40, 298/41, 298/30, 298/32, 298/29, 228/124.6, 228/56.3
• US Class Current: 29/840
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

An apparatus and method for thermally coupling a heat sink directly to a surface mount heat generating device package in a manner which provides a more efficient thermal path between the heat sink and the device package, and which allows for a simplified assembly process. The heat sink is mounted in direct thermal communication with the heat generating device package which is surface mounted to a printed circuit board or other substrate. The inventive heat sink has a reservoir of thermal preform which allows the heat sink to be secured to a device package at the same time as the device package is being secured to the surface mount substrate, as opposed to doing so in a separate step in the assembly process after the electronic device packages have already been secured to the surface mount substrate. The inventive heat sink thereby simplifies the assembly process by eliminating steps in the manufacturing process and by allowing for the further automation of the assembly process.

Claims

1. A method of thermally connecting a heat sink to a surface mount heat generating electronic device, comprising the steps of:

providing a surface mount heat generating device having a device contact region;

providing a heat sink having a heat sink contact region with an aperture formed therein, said aperture containing a reservoir of solidified thermal binder;

disposing said heat sink in proximity to said heat generating device;

melting said thermal binder for causing it to flow out of said aperture for forming a thermal and mechanical coupling between said heat sink and said device upon re-solidification of said thermal binder.

2. The method as described in claim 1, wherein said reservoir of thermal binder is supported by a feature on said heat sink.

3. The method of claim 1, wherein said step of disposing comprises the step of disposing said heat sink in contact with said heat generating device.

4. The method of claim 1, wherein said step of providing a heat generating device comprises providing a heat generating device mounted to a substrate.

5. The method of claim 4, wherein said step of disposing comprises the step of disposing said heat sink in contact with said substrate.

6. The method of claim 4, wherein said step of disposing comprises the step of disposing said heat sink in contact with said substrate and said heat generating device.

7. A method of forming a reservoir of thermal binder in a heat sink contact region for facilitating thermal and mechanical coupling of said heat sink to a heat conducting device, comprising the steps of:

providing a heat sink;

forming an aperture in the heat sink contact region, said aperture having an exit end; and

disposing said thermal binder in the aperture, whereby when said heat sink is disposed in proximity to said heat conducting device and said thermal binder is melted, said thermal binder flows out of said exit end for forming a thermal and mechanical coupling between said heat sink and said heat conducting device.

8. The method of claim 7, wherein said disposing step comprises the steps of temporarily obstructing the exit end of the aperture, melting the thermal binder in the aperture, and re-solidifying said thermal binder in the aperture thereby sealing said exit end with said thermal binder.

9. The method of claim 8, wherein said disposing step comprises disposing melted thermal binder in the aperture and re-solidifying the melted thermal binder in the aperture.

10. The method of claim 7, wherein said aperture is formed in a feature on said heat sink.