×

Stent expansion and apposition sensing

  • US 6,179,858 B1
  • Filed: 01/08/1999
  • Issued: 01/30/2001
  • Est. Priority Date: 05/12/1998
  • Status: Expired due to Fees
First Claim
Patent Images

1. A system comprising:

  • an endoluminal device including an endovascular stent;

    a catheter assembly to which said device is coupled for deployment into a lumen; and

    a sensor positioned on said catheter assembly adjacent to an end of said endoluminal device, said sensor being mechanically coupled to said lumen and adapted to provide an electrical parameter which is indicative of apposition pressure of said end of said endoluminal device to the inner wall of said lumen.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×