Plasma processing apparatus and method

• US 6,180,019 B1
• Filed: 11/26/1997
• Issued: 01/30/2001
• Est. Priority Date: 11/27/1996
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Maeda, Kenji, Tetsuka, Tsutomu, Arai, Masatsugu, Nishio, Ryoji, Tsubone, Tsunehiko, Kazumi, Hideyuki, Edamura, Manabu, Yoshioka, Ken, Doi, Akira, Kanai, Saburo
• Primary Examiner(s): Warden, Sr., Robert J.
• Assistant Examiner(s): Olsen, Kaj K.
• Application Number:
  US08/979,949
• Time in Patent Office: 1,161 Days
• Field of Search: 118/723.R, 118/723.I, 118/723.AN, 156/345, 156/345.C, 216/67, 216/68, 216/70
• US Class Current: 216/78
• CPC Class Codes: H01J 37/32009 Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources plasma generation in general H05H1/24
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H01J 37/32174 Circuits specially adapted for controlling the RF discharge

Abstract

A plasma is generated by feeding an antenna with radio-frequency electric power generated by a radio-frequency power source, and one end of the antenna is grounded to the earth through a capacitor of variable capacitance. A Faraday shield is electrically isolated from the earth, and the capacitance of the variable capacitor is determined to be such a value that the voltage at the two ends of the antenna may be equal in absolute values and inverted to reduce the partial removal of the wall after the plasma ignition. At the time of igniting the plasma, the capacitance of the capacitor is adjusted to a larger or smaller value than that minimizing the damage of the wall.

Claims

1. A method of operating a plasma processing apparatus, the plasma processing apparatus including:

an antenna for generating an electric field in a plasma generating portion, wherein the antenna has two ends, and an earth portion of the antenna is provided with a load;

a radio-frequency power sources for supplying radio-frequency electric power to said antenna;

a vacuum chamber enclosing the plasma generating portion to establish a vacuum therein;

a Faraday shield provided around the plasma generating portion;

a gas supply unit for supplying gas into said vacuum chamber;

a sample stage, in said vacuum chamber, on which an object to be processed is placed; and

another radio-frequency power source, for applying a radio-frequency electric field to said sample stage,

the method comprising the steps of;

igniting the plasma in the plasma generating portion, the Faraday shield being held in a floating state during said igniting;

processing said object with said plasma, the Faraday shield being grounded during said processing; and

adjusting said load such that, during the processing, voltages at the two ends of the antenna are substantially equal in absolute value but inverted; and

adjusting said load such that, during the igniting, voltages at the two ends of the antenna are not substantially equal in absolute value.

2. A method of operating a plasma processing apparatus, the plasma processing apparatus including:

a vacuum chamber, enclosing a plasma generating portion, to establish a vacuum therein;

an antenna, for generating an electric field in the plasma generating portion;

a radio-frequency power source, for supplying radio-frequency electric power to said antenna;

a Faraday shield provided around the plasma generating portion;

a gas supply unit for supplying gas into said vacuum chamber;

a sample stage, in said vacuum chamber, on which an object to be processed is placed;

another radio-frequency power source, for applying a radio-frequency electric field to said sample stage; and

a controllable load provided in an earth portion of said antenna,

the method comprising the steps of;

igniting the plasma in the plasma generating portion, said controllable load being adjusted such that during the igniting the two ends of the antenna have different voltages in absolute value, so as to improve ignitability of the plasma; and

processing said object with said plasma, said load being adjusted such that during the processing voltages at the two ends of the antenna are substantially equal in absolute value but inverted, so as to reduce removed amount of a wall of said vacuum chamber during the processing.