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Control of size and heat affected zone for fine pitch wire bonding

  • US 6,180,891 B1
  • Filed: 02/26/1997
  • Issued: 01/30/2001
  • Est. Priority Date: 02/26/1997
  • Status: Expired due to Fees
First Claim
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1. A product includinga first surface, a second surface, a first bonding wire having a first end bonded to a first portion of said first surface by a ball bond and a second end bonded to a first portion of said second surface, a second bonding wire having a first end bonded to a second portion of said first surface by a ball bond and a second end bonded to a second portion of said second surface, wherein the pitch between said ball bond on said first bonding wire and said ball bond on said second bonding wire on respective ones of said first and second portions of said first surface is less than 90 microns and volume of free air balls forming said ball bonds is substantially uniform.

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