Antenna-integral high frequency circuit electromagnetically coupling feeder circuit connected to high frequency circuit to microstrip antenna via slot coupling hole
First Claim
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1. An antenna-integral high frequency circuit comprising:
- a first conductor layer provided with a microstrip antenna;
a second conductor layer including a first grounding portion provided with a first slot-coupling hole;
a third conductor layer including a feeder circuit electromagnetically coupled with said microstrip antenna via said first slot coupling hole, and a second grounding portion physically separated from the feeder circuit;
a semiconductor device including a fourth conductor layer having an input/output terminal portion connected to said feeder circuit and a third grounding portion connected to said second grounding portion so that the third grounding portion is physically separated from the terminal portion, and a high frequency circuit having said fourth conductor layer on a surface thereof;
a first dielectric substrate deposited between said first and second conductor layers;
a second dielectric substrate deposited between said second and third conductor layers; and
a first connecting portion provided to connect said first grounding portion and said second grounding portion such that a distance from said first grounding portion to said third grounding portion is less than one fourth of a wavelength associated with said high frequency circuit.
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Abstract
An antenna-integral high frequency circuit includes: a first grounding conductor surrounding a microstrip antenna; a first via hole connecting the first grounding conductor and a second grounding conductor; and a second via hole connecting the second grounding conductor and a third grounding conductor such that the distance from the second grounding conductor to a fourth grounding conductor is less than a predetermined value.
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Citations
16 Claims
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1. An antenna-integral high frequency circuit comprising:
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a first conductor layer provided with a microstrip antenna;
a second conductor layer including a first grounding portion provided with a first slot-coupling hole;
a third conductor layer including a feeder circuit electromagnetically coupled with said microstrip antenna via said first slot coupling hole, and a second grounding portion physically separated from the feeder circuit;
a semiconductor device including a fourth conductor layer having an input/output terminal portion connected to said feeder circuit and a third grounding portion connected to said second grounding portion so that the third grounding portion is physically separated from the terminal portion, and a high frequency circuit having said fourth conductor layer on a surface thereof;
a first dielectric substrate deposited between said first and second conductor layers;
a second dielectric substrate deposited between said second and third conductor layers; and
a first connecting portion provided to connect said first grounding portion and said second grounding portion such that a distance from said first grounding portion to said third grounding portion is less than one fourth of a wavelength associated with said high frequency circuit.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
said first conductor layer also including a fourth grounding portion surrounding said microstrip antenna; and
a second connecting portion provided to connect said first grounding portion and said fourth grounding portion, wherein the fourth grounding portion is physically separated from the microstrip antenna.
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4. The antenna-integral high frequency circuit according to claim 1, further comprising:
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said first conductor layer also including a fourth grounding portion surrounding said microstrip antenna, wherein the fourth grounding portion is physically separated from the microstrip antenna;
a fifth conductor layer provided between said first dielectric substrate and said second conductor layer and having a fifth grounding portion provided with a second slot coupling hole aligned with the first slot coupling hole; and
a third connecting portion provided to connect said fourth grounding portion and said fifth grounding portion.
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5. The antenna-integral high frequency circuit according to claim 1, further comprising:
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said first dielectric substrate having a through hole provided between said microstrip antenna and said first slot coupling hole; and
a third dielectric substrate provided in said through hole and having a dielectric constant smaller than a dielectric constant of said first dielectric substrate.
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6. The antenna-integral high frequency circuit according to claim 1, wherein said first dielectric substrate has a recessed portion between said microstrip antenna and said first slot coupling hole such that the recessed portion places said first slot coupling hole closer to said microstrip antenna, further comprising a third dielectric substrate provided in said recessed portion and having a dielectric constant smaller than a dielectric constant of said first dielectric substrate.
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7. The antenna-integral high frequency circuit according to claim 3, wherein:
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said first dielectric substrate has a recessed portion between said microstrip antenna and said first slot coupling hole such that the recessed portion places said first slot coupling hole closer to said microstrip antenna;
said microstrip antenna is provided on a bottom surface of said recessed portion; and
said fourth grounding portion is provided at a region including a side surface of said recessed portion and surrounds said microstrip antenna.
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8. The antenna-integral high frequency circuit according to claim 1, wherein a dielectric constant of said first dielectric substrate is lower than a dielectric constant of said second dielectric substrate.
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9. The antenna-integral high frequency circuit according to claim 1, as a single multilayer body with at least said first dielectric substrate, said second dielectric substrate and said first grounding portion simultaneously fired.
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10. The antenna-integral high frequency circuit according to claim 1, further comprising a plating conductor disposed on at least one of said third and fourth conductor layers, wherein said third and fourth conductor layers are connected via said plating conductor.
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11. The antenna-integral high frequency circuit according to claim 1, further comprising a cap covering at least said semiconductor device and connected to said second grounding portion.
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12. The antenna-integral high frequency circuit according to claim 1, wherein at least one of said first and second dielectric substrates is fired simultaneously with an adjacent conductor layer.
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13. The antenna-integral high frequency circuit according to claim 1, wherein said high frequency circuit includes a frequency converting portion that converts a high frequency signal into an intermediate frequency signal.
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14. The antenna-integral high frequency circuit according to claim 1, wherein the second dielectric substrate has a thickness of about 250 μ
- m.
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15. The antenna-integral high frequency circuit according to claim 1, wherein the substrates are deposited without the use of an adhesive.
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16. The antenna-integral high frequency circuit according to claim 1, wherein the first dielectric substrate has a thickness of about 150 μ
- m.
Specification