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Method and apparatus for transferring signals through a high density, low profile, array type stacking connector

  • US 6,183,266 B1
  • Filed: 09/10/1998
  • Issued: 02/06/2001
  • Est. Priority Date: 09/10/1998
  • Status: Expired due to Term
First Claim
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1. An apparatus comprising:

  • a first engaging contact member, comprising a pin, mounted on a first circuit board and electrically coupled to a first signal line of the first circuit board;

    a second engaging contact member, comprising a socket, for removably engaging said first engaging contact member, said second engaging contact member being mounted on a second circuit board and electrically connected to a second signal line of the second circuit board, said socket having a socket cylindrical portion that is supported by a socket support member and has an open top end and an open bottom end;

    a conductive barrier member partially surrounding the second engaging contact member, said barrier member having at least one connector coupling said barrier member to at least one bias voltage line;

    an insulating material disposed between the barrier member and said second engaging contact member, and wherein said barrier member further comprises a plurality of retaining tabs extending inwardly.

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