Post photodevelopment isotropic radiation treatment method for forming patterned photoresist layer with attenuated linewidth

• US 6,183,937 B1
• Filed: 05/06/1998
• Issued: 02/06/2001
• Est. Priority Date: 05/06/1998
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Tao, Hun-Jan, Tsai, Chia-Shiung
• Primary Examiner(s): Duda, Kathleen
• Application Number:
  US09/072,997
• Time in Patent Office: 1,007 Days
• Field of Search: 430/313, 430/328, 430/317, 430/323, 430/325, 430/290, 430/330
• US Class Current: 430/313
• CPC Class Codes: G03F 7/0045 with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
• CPC Class Codes: G03F 7/2024 of the already developed image
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking

Abstract

A method for forming a patterned photoresist layer. There is first provided a substrate employed within a microelectronics fabrication. There is then formed over the substrate a blanket photoresist layer. There is then photoexposed and developed the blanket photoresist layer to form a patterned photoresist layer having a first linewidth. There is then irradiated isotropically the patterned photoresist layer with an isotropic radiation source to decompose a conformal surface layer of the patterned photoresist layer while simultaneously forming a conformal surface layer decomposed patterned photoresist layer having a second linewidth narrower than first linewidth. The conformal surface layer decomposed patterned photoresist layer may then be employed as an etch mask layer when etching a blanket microelectronics layer formed interposed between the substrate and the conformal surface layer decomposed patterned photoresist layer. Through the method there may be formed a patterned microelectronics layer of narrow linewidth without employing an advanced photoexposure apparatus.

Claims

1. A method for forming a patterned photoresist layer comprising:

providing a substrate;

forming over the substrate a blanket photoresist layer formed from a positive chemically amplified photoresist material;

photoexposing and developing the blanket photoresist layer to form a patterned photoresist layer having a first linewidth; and

irradiating isotropically the patterned photoresist layer with an isotropic radiation source to partially decompose the patterned photoresist layer and thus form a partially decomposed patterned photoresist layer having a second linewidth narrower than the first linewidth, wherein the patterned photoresist layer is isotropically irradiated while the substrate is at a temperature of 100 to 200 degrees centigrade.

2. The method of claim 1 wherein the substrate is employed in a microelectronics fabrication selected from the group consisting of an integrated circuit microelectronics fabrication, a solar cell microelectronics fabrication, a ceramic substrate microelectronics fabrication and a flat panel display microelectronics fabrication.

3. The method of claim 1 wherein the isotropic radiation source is selected from the group consisting of deep ultraviolet radiation sources, near ultraviolet radiation sources, multiple wavelength flood ultraviolet radiation sources, electron radiation sources and ion radiation sources.

4. The method of claim 1 further comprising:

forming a blanket microelectronics layer over the substrate prior to forming the blanket photoresist layer over the substrate, the blanket photoresist layer being formed upon the blanket microelectronics layer; and

etching, while employing an anisotropic plasma etch method, the blanket microelectronics layer to form a patterned microelectronics layer while employing the partially decomposed patterned photoresist layer as an etch mask layer.

5. The method of claim 4 wherein the microelectronics layer is selected from the group consisting of microelectronics conductor layers, microelectronics semiconductor layers and microelectronics dielectric layers.

6. A method for forming a gate electrode comprising:

providing a semiconductor substrate;

forming upon the semiconductor substrate a gate dielectric layer;

forming upon the gate dielectric layer a blanket gate electrode material layer;

forming upon the blanket gate electrode material layer a blanket photoresist layer formed from a positive chemically amplified photoresist material;

photoexposing and developing the blanket photoresist layer to form a patterned photoresist layer having a first linewidth;

irradiating isotropically the patterned photoresist layer with an isotropic radiation source to partially decompose the patterned photoresist layer and thus form a partially decomposed patterned photoresist layer having a second linewidth narrower than the first linewidth, wherein the patterned photoresist layer is isotropically irradiated while the semiconductor substrate is at a temperature of 100 to 200 degrees centigrade; and

etching anisotropically the blanket gate electrode material layer to form a gate electrode while employing the partially decomposed patterned photoresist layer as an etch mask layer.

7. The method of claim 6 wherein the isotropic radiation source is selected from the group consisting of deep ultraviolet radiation sources, near ultraviolet radiation sources, multiple wavelength flood ultraviolet radiation sources, electron radiation sources and ion radiation sources.