Multi-layer circuit substrate having orthogonal grid ground and power planes

• US 6,184,477 B1
• Filed: 12/02/1998
• Issued: 02/06/2001
• Est. Priority Date: 12/02/1998
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Tanahashi, Shigeo
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US09/204,136
• Time in Patent Office: 797 Days
• Field of Search: 174/255, 174/261, 174/262, 361/780, 361/784, 361/792, 361/793, 361/794, 361/795, 361/799, 361/800
• US Class Current: 174/261
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0253 Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings H05K1/0251 takes precedence
• CPC Class Codes: H05K 1/0289 having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/09681 Mesh conductors, e.g. as a ground plane

Abstract

A multi-layer circuit substrate is designed to ensure uniform impedance characteristics for signal conductors even when such conductors are installed at a high density. The device consists of a plurality of planar insulating layers laminated together. In one embodiment a first insulating layer bears a first ground plane formed as an orthogonal grid. A second insulating layer, laminated to the first layer, bears a first set of signal wiring, the traces of which are disposed parallel to one of the orthogonal axes of the ground plane. A third insulating layer, laminated to the second layer, bears either a second ground plane formed as an orthogonal grid or a power plane formed as an orthogonal grid. A fourth insulating layer, laminated to the third layer, bears a second set of signal wiring, the traces of which are disposed parallel to the other orthogonal axis of the first ground plane. The first and second sets of signal wiring are in electrical communication by means of conductors normal to the surface of the device. A fifth insulating layer, laminated to the fourth layer, bears either a second or third ground plane formed as an orthogonal grid. Line widths of the various conductors are selected to optimize the electrical characteristics of the device.

Claims

1. A multi-layer circuit substrate comprising:

first to fifth insulating layers laminated sequentially,

the first insulating layer having an upper face on which a first ground wiring conductor is installed in the shape of a grid;

the second insulating layer having an upper face on which a first signal wiring conductor is installed so as to overlie a wiring conductor in one of grid line directions of the first ground wiring conductor;

the third insulating layer having an upper face on which a second ground wiring conductor is installed so as to overlie the first ground wiring conductor, the second ground wiring conductor having almost the same grid shape as that of the first ground wiring conductor;

the fourth insulating layer having an upper face on which a second signal wiring conductor is installed so as to overlie a wiring conductor in the other grid line direction of the first ground wiring conductor;

the fifth insulating layer having an upper face on which a third ground wiring conductor is installed so as to overlie the first ground wiring conductor, the third ground wiring conductor having almost the same grid shape as that of the first ground wiring conductor,

wherein a line width of the first signal wiring conductor is equal to or narrower than line widths of the first and second ground wiring conductors, and a line width of the second signal wiring conductor is equal to or narrower than line widths of the second and third ground wiring conductors, and

wherein the first signal wiring conductor and the second signal wiring conductor are connected to each other via a through conductor which passes through the third and fourth insulating layers and the second ground wiring conductor so as to be insulated from the second ground wiring conductor.

4. The multi-layer circuit substrate of any one of claims 1 to 3, wherein aperture area ratios of respective grid of the first to third ground wiring conductors and the power wiring conductor which are installed in shapes of grids, are in a range of 5% to 80%.

5. The multi-layer circuit substrate of any one of claims 1 to 3, wherein the first insulating layer is formed of a ceramic material, and the other insulating layers are formed of a resin material.

6. The multi-layer circuit substrate of claim 5, wherein each of the first and the second signal wiring conductors are composed of an adhesive metal layer formed of a metal selected from the group consisting of chromium, titanium, molybdenum and niobium, and a main conductor metal layer formed of a metal selected from the group consisting of copper, silver and gold.

7. The multi-layer circuit substrate of claim 6, wherein a thickness of the adhesive metal layer is in a range of 0.03 μ

m to 0.2 μ

m and a thickness of the main conductor metal layer is in a range of 1 μ

m to 10 μ

m.

2. A multi-layer circuit substrate comprising:

first to fourth insulating layers laminated sequentially,

the first insulating layer having an upper face on which a first ground wiring conductor is installed in the shape of a grid;

the second insulating layer having an upper face on which a first signal wiring conductor is installed so as to overlie a wiring conductor in one of grid line directions of the first ground wiring conductor;

the third insulating layer having an upper face on which a second signal wiring conductor is installed so as to overlie a wiring conductor in the other grid line direction of the first ground wiring conductor;

the fourth insulating layer having an upper face on which a second ground wiring conductor is installed so as to overlie the first ground wiring conductor, the second ground wiring conductor having almost the same grid shape as that of the first ground wiring conductor,

wherein line widths of the first and second signal wiring conductors are equal to or narrower than line widths of the first and second ground wiring conductors, and

wherein the first signal wiring conductor and the second signal wiring conductor are connected to each other via a through conductor which passes through the third insulating layer.

3. A multi-layer circuit substrate comprising:

first to fifth insulating layers laminated sequentially,

the first insulating layer having an upper face on which a first ground wiring conductor is installed in the shape of a grid;

the second insulating layer having an upper face on which a first signal wiring conductor is installed so as to overlie a wiring conductor in one of grid line directions of the first ground wiring conductor;

the third insulating layer having an upper face on which a power wiring conductor is installed so as to overlie the first ground wiring conductor, the power wiring conductor having almost the same grid shape as that of the first ground wiring conductor;

the fourth insulating layer having an upper face on which a second signal wiring conductor is installed so as to overlie a wiring conductor in the other grid line direction of the first ground wiring conductor;

the fifth insulating layer having an upper face on which a second ground wiring conductor is installed so as to overlie the first ground wiring conductor, the second ground wiring conductor having almost the same grid shape as that of the first ground wiring conductor,

wherein a line width of the first signal wiring conductor is equal to or narrower than line widths of the first ground wiring conductor and the power wiring conductor, and a line width of the second signal wiring conductor is equal to or narrower than line widths of the power wiring conductor and the second ground wiring conductor, and

wherein the first signal wiring conductor and the second signal wiring conductor are connected to each other via a through conductor which passes through the third and fourth insulating layers and the power wiring conductor so as to be insulated from the power wiring conductor.