Semiconductor pressure sensor for sensing fluid pressure

• US 6,186,009 B1
• Filed: 07/06/1998
• Issued: 02/13/2001
• Est. Priority Date: 07/10/1997
• Status: Expired due to Fees

• Current Assignee: Fujikoki Corporation
• Original Assignee: Fujikoki Corporation
• Inventors: Sawada, Akira, Sasaki, Keiji, Miyano, Junichi
• Primary Examiner(s): OEN, WILLIAM L
• Application Number:
  US09/110,322
• Time in Patent Office: 953 Days
• Field of Search: 737/15, 737/16, 737/17, 737/18, 737/19, 737/20, 737/21, 737/22, 737/23, 737/24, 737/25, 737/26, 737/27, 737/56, 338/4, 338/42
• US Class Current: 73/756
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
• CPC Class Codes: G01L 9/06 of piezo-resistive devices

Abstract

The object of the present invention is to provide a pressure sensor comprising a pressure sensing element of a plurality of resistors on a semiconductor board, wherein said pressure sensing element is fixed inside the housing firmly and airtightly. A pressure sensor 10 comprising a housing 11 made of metal material, and a pressure sensing element mounted on a semiconductor board 13 positioned in the interior of said housing for sensing pressure, wherein said housing 11 comprises a liquid induction hole 11d, an inner area connecting to said liquid induction hole and having an opening in an upper portion, and an annular protrusion 11g formed in the peripheral of an opening of said liquid induction hole at a bottom portion of said inner area, characterized in that said pressure sensing element 13 is welded airtightly to said protrusion 11g of said housing 11 through a seat 21 comprising an opening 21a at the center thereof formed of a pressure sensing element mounting member 21-1 and a stem connecting member 20d, and a stem 20 having an opening 20d at the center thereof.

Claims

1. A pressure sensor comprising:

a housing made of metal material, said housing defining an inner area of said pressure sensor;

a semiconductor pressure sensing element positioned in said inner area of said housing for sensing pressure;

a pressure sensing element mounting member having an opening; and

a stem having an opening,

wherein said housing comprises;

a liquid induction portion having a liquid induction hole, said liquid induction hole having an opening to said inner area of said housing; and

an annular protrusion formed on said housing surrounding a periphery of said opening of said liquid induction hole,

wherein said pressure sensing element is fixed airtightly to said stem through said pressure sensing element mounting member,

said stem is fixed airtightly to a top surface of said protrusion of said housing, and

said opening of said pressure sensing element mounting member and said opening of said stem are connected to said liquid induction hole.

5. The pressure sensor disclosed in claims 1 or 2, wherein a gold plated layer is formed on at least a portion of the stem opposing said stem connecting member, and a gold plated layer is formed on at least a portion of the stem connecting member opposing the stem, and the welding of the stem and the stem connecting member is performed by a gold and silicon alloy formed by adding heat.

6. The pressure sensor disclosed in claims 1 or 2 wherein said pressure sensing element mounting member of said seat is formed of glass, said stem connecting member is formed of silicon or silicon alloy, and said stem is formed of 42 alloy.

7. The pressure sensor disclosed in claims 1 or 2 wherein said pressure sensing element comprises a thin diaphragm portion formed in the center area of the semiconductor board and a thick portion formed on the peripheral area thereof which is strong against deformation, and a pressure sensing portion having a plurality of resistors is mounted on said diaphragm portion in the center area, and a calculating portion formed by an integrated circuit manufacturing technique is mounted on said thick portion in the peripheral area.

8. The pressure sensor disclosed in claims 1 or 2 wherein said pressure sensing element comprises a thin diaphragm portion formed in the center area of the semiconductor board and a thick portion formed on the peripheral area thereof which is strong against deformation, and a pressure sensing portion having a piezoresistor is mounted on said diaphragm portion in the center area, and a calculating portion formed by an integrated circuit manufacturing technique is mounted on said thick portion in the peripheral area.

2. A pressure sensor comprising:

a housing made of metal material, said housing defining an inner area of said pressure sensor;

a pressure sensing element mounted on a semiconductor board positioned in said inner area of said housing for sensing pressure,

a pressure sensing element mounting member having an opening;

a stem connecting member having an opening; and

a stem having an opening,

wherein said housing comprises;

a liquid induction portion having a liquid induction hole, said liquid induction hole having an opening in said inner area of said housing; and

an annular protrusion formed on said housing surrounding a periphery of said opening of said liquid induction hole,

wherein said pressure sensing element is fixed airtightly to pressure sensing element mounting member,

said pressure sensing element mounting member and said stem are fixed airtightly through said stem connecting member,

said stem is fixed airtightly on a top surface of said protrusion of the housing, and said opening of said pressure sensing element mounting member, said opening of said stem connecting member and said opening of said stem are connected to said liquid induction hole.

3. The pressure sensor of claim 2, wherein the fixing of said stem and said protrusion is performed by welding the stem and the protrusion by an electrical resistance weld.

4. The pressure sensor of claim 2, wherein the fixing of said pressure sensing element and said pressure sensing element mounting member, and the fixing of said pressure sensing element mounting member and said stem connecting member is performed by anode connection weld.

9. A pressure sensor comprising:

a housing having a fluid induction hole, said induction hole having an opening to an inner area of said housing, said housing further having an annular protrusion surrounding a periphery of said opening of said hole;

a semiconductor pressure sensing element for sensing pressure;

a mounting member for airtightly mounting said pressure sensing element; and

a stem being airtightly fixed to said mounting member and to a top surface of said annular protrusion of said housing,

wherein each of said mounting member and said stem defines a hole connected to said induction hole of said housing.

10. A pressure sensor comprising:

a housing defining an inner area and an outer area of said pressure sensor, said housing having a liquid induction portion having a liquid induction hole connecting said inner area and said outer area of said housing, said liquid induction hole having an opening to said inner area of said housing,

a semiconductor pressure sensing element positioned in said inner area of said housing for sensing pressure,

a mounting member for airtightly mounting said pressure sensing element; and

a stem for airtightly mounting said mounting member,

wherein

an annular protrusion is formed on said housing surrounding a periphery of said opening of said liquid induction hole,

said stem is airtightly fixed on a top surface of said protrusion, and

each of said mounting member and said stem has an opening defining a hole connected to said liquid induction hole.

11. A pressure sensor comprising:

a housing having a fluid induction hole, said induction hole having an opening to an inner area of said housing, said housing further having an annular protrusion surrounding a periphery of said opening of said hole;

a semiconductor pressure sensing element for sensing pressure; and

a stem having an opening, said opening of said stem being connected to said opening of said induction hole, said stem being airtightly fixed on a top surface of said annular protrusion of said housing, and said semiconductor pressure sensing element being mounted on said stem.