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Device for patterned films

  • US 6,187,110 B1
  • Filed: 05/21/1999
  • Issued: 02/13/2001
  • Est. Priority Date: 05/12/1997
  • Status: Expired due to Term
First Claim
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1. A multilayered substrate comprising:

  • a substrate, said substrate comprising a plurality of devices defined thereon, said substrate also comprising a dielectric layer formed overlying said devices and a surface that is substantially planar overlying said dielectric layer;

    a plurality of particles defined in said substrate at a selected depth underneath said surface and said devices, said particles being at a concentration at said selected depth to define a substrate material to be removed above said selected depth;

    a target substrate joined to said surface of said substrate; and

    energy applied to a selected region of said substrate to initiate a controlled cleaving action at said selected depth in said substrate, whereupon said cleaving action is made using a propagating cleave front to free a portion of said material to be removed from said substrate.

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