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Process for forming mask pattern and process for producing thin film magnetic head

  • US 6,187,513 B1
  • Filed: 05/21/1999
  • Issued: 02/13/2001
  • Est. Priority Date: 05/29/1998
  • Status: Expired due to Fees
First Claim
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1. A process for forming a mask pattern comprisinga first coating step of coating a first resist on a surface, on which said mask pattern is formed;

  • a first exposure step of forming a pattern latent image in said first resist by exposing the first resist;

    a second coating step of coating a second resist on said first resist, in which said pattern latent image is formed in said first exposure step;

    a second exposure step of forming a pattern latent image in said second resist by exposing said second resist;

    a first development step of forming an upper layer mask pattern by developing said second resist, in which said latent image is formed in said second exposure step, with a first developer; and

    a second development step of forming a lower layer mask pattern by developing said first resist, in which said latent image is formed in said first exposure step, with a second developer, said upper layer mask pattern having a resist bridge part in a resist remaining part, in which said second resist remains, said bridge part bridging over a part of said lower mask pattern, in which said first resist is removed, and a space being present between said resist bridge part and said surface, on which said mask pattern is formed.

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