Electronic component, method for making the same, and lead frame and mold assembly for use therein

• US 6,187,614 B1
• Filed: 08/24/1999
• Issued: 02/13/2001
• Est. Priority Date: 03/07/1996
• Status: Expired due to Term

• Current Assignee: Collabo Innovations, Inc. (Wi-LAN Inc.)
• Original Assignee: Matsushita Electric Corporation (Panasonic Holdings Corporation)
• Inventors: Takata, Hirofumi, Tanida, Tadashi
• Primary Examiner(s): Picardat, Kevin M.
• Assistant Examiner(s): COLLINS, DEVEN M
• Application Number:
  US09/379,623
• Time in Patent Office: 539 Days
• Field of Search: 257/787, 438/112, 438/124, 438/127
• US Class Current: 438/112
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18301 : being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H05K 3/3426 : characterised by the leads

Abstract

A lead has a thick part having a thickness of 0.2 mm and a thin part having a thickness of 0.1 mm. The thin part is formed having a greater width than the thick part for preventing the lead from slipping from a resin. A semiconductor chip is fixed on the thin part using a conductive adhesive. A lateral surface of the thick part and a lateral surface of the resin are simultaneously formed by a single cut so that the thick part'"'"'s lateral surface is located at a lower end area of the resin'"'"'s lateral surface and these surfaces are exposed forming the same plane. A bottom surface of the thick part projects by from 0.03 mm to 0.05 mm from the resin bottom surface to meet lead stand-off specifications. Thick parts of other leads electrically connected with electrodes on the semiconductor chip with Au wires, are likewise exposed at the resin lateral surface and project from the resin bottom surface. Such arrangements realize high density mounting of electronic components onto a printed board.

Claims

1. A method of fabricating a plurality of electronic components of a resin molded package type, said method comprising:

(a) over a plate-like lead frame comprising a plurality of bridge parts which are formed into a lattice and a plurality of sets of lead parts which extend towards a plurality of lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said plurality of bridge parts, a step of fixing each of a plurality of electronic elements in a corresponding lattice open space of said plurality of lattice open spaces;

(b) a step of electrically connecting each said electronic element with a corresponding set of lead parts of said plurality of sets of lead parts;

(c) a step of encapsulating said plurality of electronic elements and said plurality of sets of lead parts with a resin so that said plurality of electronic elements and said plurality of sets of lead parts are continuous with one another through common gates at least in one direction;

(d) a step of cutting said lead frame together with said resin such that said plurality of sets of lead parts of said lead frame are separated from said plurality of bridge parts respectively and resin cut surfaces and lead cut surfaces are formed at the same time on individual package lateral surfaces of said plurality of electronic components; and

(e) a step of forming a plurality of grooves for guiding a cutting blade to be used in said cutting step in a top surface of said resin along said bridge parts of said lead frame,

wherein each said groove is formed at least between two adjacent electronic elements of said plurality of electronic elements, and

wherein each said groove has a bottom width and a top width, said top width being greater than said bottom width.

2. The electronic component fabrication method of claim 1, wherein said plurality of grooves are formed at least where said resin cut surfaces and lead cut surfaces of said plurality of electronic components are formed at the same time.

3. The electronic component fabrication method of claim 1, wherein said plurality of grooves are formed horizontally and perpendicularly along said bridge parts of said lead frame.

4. The electronic component fabrication method of claim 1, wherein each said groove is formed of a pair of elongated grooves running parallel with each other.

5. The electronic component fabrication method of claim 1 further comprising a step of forming a plurality of ridges for use in locating a cutting blade to be used in said cutting step in a top surface of said resin along said bridge parts of said lead frame.

6. The electronic component fabrication method of claim 5, wherein said plurality of ridges are formed horizontally and perpendicularly along said bridge parts of said lead frame.

7. The electronic component fabrication method of claim 5, wherein the maximum width of each said ridge is greater than the width of said bridge part.