Trench DMOS device having an amorphous silicon and polysilicon gate

• US 6,188,104 B1
• Filed: 03/27/1998
• Issued: 02/13/2001
• Est. Priority Date: 03/27/1997
• Status: Expired due to Term

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Jeong, Dong-Soo, Choi, Mun-Heui
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): Warren, Matthew E.
• Application Number:
  US09/049,601
• Time in Patent Office: 1,054 Days
• Field of Search: 257/330, 257/332, 257/333, 257/335, 257/328, 257/374, 257/397, 257/520, 257/619, 257/622, 257/60, 257/127, 257/170
• US Class Current: 257/330
• CPC Class Codes: H01L 29/4925 with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with only a vertical doping structure or vertical doping variation H01L29/4916
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

A trench DMOS device has a gate insulating layer on the bottom and sidewalls of the trench. The upper edges of the trench have an impurity injection region and are rounded. In addition, a first conductive layer is formed on the gate insulating layer, and a second conductive layer is formed on the first conductive layer and filled in the trench. The second conductive layer has different crystallization from the first conductive layer. As such the first conductive layer acts as a buffer between the gate insulating layer and the filled in second conductive layer. A method for fabricating a trench DMOS device includes the steps of forming an epitaxial layer on a semiconductor substrate. Then an impurity is injected into the epitaxial layer to form an impurity injection region. Then a trench is formed in the semiconductor substrate passing through the impurity injection region. Then a dry etching process is used to round the upper edges of the trench. Then an insulating layer is formed on the bottom and the sidewalls of the trench as the gate insulating layer. Then a first conductive layer is formed on the gate insulating layer, and a second conductive layer is formed on the first conductive layer and filled in the trench. The second conductive layer has different crystallization from the first conductive layer.

Claims

1. A trench DMOS device comprising:

a semiconductor substrate having a trench therein, the trench defining a bottom and sidewalls;

a gate insulating layer formed on the bottom and the sidewalls;

a first conductive layer formed on substantially all of the gate insulating layer, said first conductive layer formed over an upper edge of the trench; and

a second conductive layer formed on the first conductive layer, filling in the trench, and having a different crystallization from the first conductive layer.

2. The trench DMOS device according to claim 1, wherein the first conductive layer is an amorphous silicon layer and the second conductive layer is a polysilicon layer.

3. The trench DMOS device according to claim 1, wherein said first conductive layer has been formed by low pressure chemical vapor deposition.

4. The trench DMOS device according to claim 1, wherein the first conductive layer has a thickness of about 500-1500 Å

.

5. The trench DMOS device according to claim 1, wherein the first conductive layer has been formed in the temperature range of about 540-580°

C.

6. The trench DMOS device according to claim 1, wherein the first conductive layer has been formed in the pressure range of 200-300 mTorr.

7. The trench DMOS device according to claim 1, wherein the second conductive layer has a thickness of about 1.15-1.25 μ

m.

8. The trench DMOS device according to claim 1, wherein the second conductive layer has been formed at a temperature of about 620°

C.

13. The trench DMOS device according to claim 1, wherein the epitaxial layer includes a guard ring at a bottom thereof.

9. A trench DMOS device comprising:

a semiconductor substrate of a first conductivity type;

an epitaxial layer of a second conductivity type formed on the semiconductor substrate, the second conductivity type being different than the first conductivity type;

a trench formed in the semiconductor substrate and passing through the epitaxial layer, the trench defining a bottom and sidewalls;

an impurity injection region of the first conductivity type formed on opposite sides of a top of the trench;

a gate oxide layer formed on the bottom and the sidewalls;

an amorphous silicon layer formed on substantially all of the gate oxide layer; and

a polysilicon layer filled in the trench and formed on the amorphous silicon layer.

14. The trench DMOS device according to claim 9, wherein the epitaxial layer includes a guard ring at a bottom thereof.

10. A trench DMOS device comprising:

a semiconductor substrate of a first conductivity type;

an epitaxial layer of a second conductivity type formed on the semiconductor substrate, the second conductivity type being different than the first conductivity type;

a trench formed in the semiconductor substrate passing through the epitaxial layer, said trench having a round-shaped structure at both side edges of a top thereof, the trench having formed on a bottom and sidewalls thereof a gate oxide layer, the gate oxide layer having formed thereon an amorphous silicon layer and the amorphous silicon layer having formed thereon a polysilicon layer, the polysilicon substantially filling the trench;

wherein the amorphous silicon layer formed on substantially all of the gate oxide layer, and

an impurity injection region of the first conductivity type formed on both sides of the top of the trench.

11. The trench DMOS device according to claim 10, wherein the round-shaped structure is formed by etching using argon gas.

12. A trench DMOS device comprising:

a semiconductor substrate of a first conductivity type;

an epitaxial layer of a second conductivity type formed on the semiconductor substrate, the second conductivity type being different than the first conductivity type;

a trench formed in the semiconductor substrate passing through the epitaxial layer, said trench having a round-shaped structure at both side edges of a top thereof;

an impurity injection region of the first conductivity type formed on both sides of the top of the trench;

a gate oxide layer formed on a bottom and both sidewalls of the trench;

an amorphous silicon layer formed on substantially all of the gate oxide layer; and

a polysilicon layer filled into the trench and on the amorphous silicon layer.