Monoblock structure for stacked components

• US 6,188,128 B1
• Filed: 02/09/1998
• Issued: 02/13/2001
• Est. Priority Date: 02/10/1997
• Status: Expired due to Term

• Current Assignee: Alcatel SA (Nokia Corporation)
• Original Assignee: Alcatel SA (Nokia Corporation)
• Inventors: Drevon, Claude
• Primary Examiner(s): Fahmy, Wael
• Assistant Examiner(s): Lee, Hsien-Ming
• Application Number:
  US09/020,413
• Time in Patent Office: 1,100 Days
• Field of Search: 438/109, 438/107, 438/106, 257/686, 333/246, 333/247
• US Class Current: 257/686
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06582 Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06593 Mounting aids permanently on device; arrangements for alignment use of temporary supports H01L21/6835
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards

Abstract

A monoblock structure comprises at least two stacked component levels, each component level comprising a layer of insulative material forming a component and encapsulation storey, at least one component and at least a first track a first end of which is connected to a connection point of the component. The structure further comprises at least one second track disposed laterally and a first end of which is connected to a second end of the first track. It additionally comprises a printed circuit forming a printed circuit storey and supporting at least one third track. A first end of the third track is coupled to a single input and/or output member one end of which is exposed on a face of the structure parallel to the component and printed circuit storeys and a second end of the third track is connected to a second end of the second track.

Claims

1. A monoblock structure comprising:

a plurality of component levels arranged in a stack, each component level having

(1) a component,

(2) a first track extending from said component, and

(3) a layer of insulative material encapsulating said component and said first track to form a solid body;

a second track connected to at least one of said first tracks of said component levels; and

a printed circuit arranged in said stack, and carrying a third track, said third track having

(1) a first end coupled to an input and/or output member exposed on a face of said stack parallel to said component levels, and

(2) a second end connected to said second track.

2. A monoblock structure comprising:

a plurality of component levels arranged in a stack, each component level having

(1) a component,

(2) a first track extending from said component, and

(3) a layer of insulative material encapsulating said component and said first track to form a solid body;

a second track connected to at least one of said first tracks of said component levels; and

a printed circuit arranged in said stack, and carrying a third track, said third track having

(1) a first end coupled to an input and/or output member exposed on a face of said stack parallel to said component levels, and

(2) a second end connected to said second track,

wherein said signal input and/or output member is a pin extending through a metallized hole in said printed circuit.

3. A monoblock structure comprising:

a plurality of component levels arranged in a stack, each component level having

(1) a component,

(2) a first track extending from said component, and

(3) a layer of insulative material encapsulating said component and said first track to form a solid body;

a second track connected to at least one of said first tracks of said component levels; and

a printed circuit arranged in said stack, and carrying a third track, said third track having

(1) a first end coupled to an input and/or output member exposed on a face of said stack parallel to said component levels, and

(2) a second end connected to said second track,

wherein said signal input and/or output member is a waveguide member carrying a grounding pin, said grounding pin extends through a metallized hole in said printed circuit that forms one end of a grounding track, and said first end of said third track is coupled to said waveguide.