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Platen for semiconductor workpieces

  • US 6,188,563 B1
  • Filed: 09/14/1998
  • Issued: 02/13/2001
  • Est. Priority Date: 09/18/1997
  • Status: Expired due to Term
First Claim
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1. A platen for supporting a semiconductor workpiece for processing, said platen comprising an electrically insulating body having an upper workpiece support surface and a base;

  • an RF electrode disposed in the body between the support surface and the base and extending generally parallel thereto; and

    a ground plane electrode disposed in the body between the RF electrode and the base.

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  • 6 Assignments
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