Method and apparatus for compensating non-uniform wafer processing in plasma processing chamber
First Claim
1. A method for compensating non-uniform wafer processing in a plasma processing chamber having an electrostatic chuck for clamping a wafer, said electrostatic chuck having a plurality of layers, the method comprising:
- processing a first wafer on an electrostatic chuck in a first plasma processing chamber, said first wafer being exposed to a plasma in said first plasma processing chamber;
determining non-uniformity characteristics of said processed first wafer;
configuring one or more layers of said electrostatic chuck to substantially compensate for said non-uniformity characteristics on said first wafer; and
processing a second wafer on said configured electrostatic chuck.
1 Assignment
0 Petitions
Accused Products
Abstract
A method and apparatus for compensating non-uniform wafer processing in a plasma processing chamber. The plasma processing chamber has an electrostatic chuck for clamping a wafer. The electrostatic chuck has one or more layers. A first wafer is processed on an electrostatic chuck in a first plasma processing chamber by exposing the first wafer to a plasma. Then, non-uniformity characteristics of the processed first wafer are determined. Based on the non-uniformity characteristics, one or more layers of the electrostatic chuck are configured to substantially compensate for the non-uniformity characteristics. A second wafer is then processed on the configured electrostatic chuck to produce substantially uniform process results.
88 Citations
36 Claims
-
1. A method for compensating non-uniform wafer processing in a plasma processing chamber having an electrostatic chuck for clamping a wafer, said electrostatic chuck having a plurality of layers, the method comprising:
-
processing a first wafer on an electrostatic chuck in a first plasma processing chamber, said first wafer being exposed to a plasma in said first plasma processing chamber;
determining non-uniformity characteristics of said processed first wafer;
configuring one or more layers of said electrostatic chuck to substantially compensate for said non-uniformity characteristics on said first wafer; and
processing a second wafer on said configured electrostatic chuck. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
selecting said specified layer of said electrostatic chuck;
determining impedance each of the partitioned portions of the selected layer for providing DC bias to said second wafer, said DC bias for attracting said ions in a substantially uniform manner to said first wafer; and
configuring said selected layer to attract ions of a second plasma in a substantially uniform manner to said second wafer.
-
-
15. The method as recited in claim 14, wherein said selected layer is configured in a shape to provide said impedance.
-
16. The method as recited in claim 4, wherein said electrostatic chuck includes an electrode layer, wherein said electrode layer is partitioned into said plurality of portions, wherein said electrostatic chuck further includes a plurality of impedance elements coupled to said partitioned portions so as to provide varying DC bias on said wafers such that said non-uniformity characteristics are substantially compensated.
-
17. The method as recited in claim 1, wherein said plasma processing chamber has an electrode disposed over said wafer, wherein said electrode includes a plurality of electrically partitioned portions that are configured to substantially configured to compensate for said non-uniformity characteristics on said first wafer.
-
18. The method as recited in claim 17, wherein said electrode is arranged in a shape that is adapted to compensate for said non-uniformity characteristics.
-
19. The method as recited in claim 17, wherein said electrode is arranged to have a plurality of materials that are adapted to compensate for said non-uniformity characteristics.
-
20. The method as recited in claim 17, wherein a plurality of impedance elements are coupled to said partitioned portions so as to provide varying DC bias on said wafers such that said non-uniformity characteristics are substantially compensated.
-
21. The method as recited in claim 1, wherein said one or layers include a dielectric layer.
-
22. The method as recited in claim 1, wherein said one or more layers include an electrode layer.
-
23. A method for compensating non-uniform plasma processing in a plasma processing chamber having an electrostatic chuck for clamping a wafer, said processing chamber having an electrode disposed over said wafer, the method comprising:
-
processing a first wafer on said electrostatic chuck in a first plasma processing chamber, said first wafer being exposed to a plasma between said electrostatic chuck and an electrode in said first plasma processing chamber;
determining non-uniformity characteristics of said processed first wafer;
configuring said electrode into a plurality of electrically partitioned portions to substantially compensate for said non-uniformity characteristics on said first wafer; and
processing a second wafer on said configured electrode. - View Dependent Claims (24, 25, 26, 27, 28)
-
-
29. An electrostatic chuck for clamping a wafer during plasma processing in a plasma processing chamber, comprising:
-
a first layer having a varying first impedance adapted to produce a varying DC bias over said wafer such that ions in a plasma in said plasma processing chamber are attracted to said wafer in a substantially uniform manner over said wafer; and
an electrode disposed under said first layer for transmitting RF power to said plasma. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36)
-
Specification