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Split optics arrangement for vision inspection/sorter module

  • US 6,188,784 B1
  • Filed: 03/03/1998
  • Issued: 02/13/2001
  • Est. Priority Date: 07/12/1996
  • Status: Expired due to Fees
First Claim
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1. In a method of determining lead integrity of IC devices having leads, comprising the steps of:

  • providing illumination of the leads;

    producing a back lit outline of at least one side of the IC device to create a silhouette of the leads;

    simultaneously recording the image of three orthogonal views of the IC device leads with a single camera.

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