×

Packaged microelectromechanical devices and systems

  • US 6,188,814 B1
  • Filed: 08/03/1999
  • Issued: 02/13/2001
  • Est. Priority Date: 08/03/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A packaged microelectromechanical device comprising:

  • a housing having a plurality of ports;

    a bundle of a plurality of optical fibers in a first one of said plurality of ports; and

    an array-type microelectromechanical device in a second one of said plurality of ports of said housing, said microelectromechanical device including a plurality of elements adapted for interacting with said plurality of optical fibers, whereby information may be transmitted into said housing via one of said plurality of optical fibers and may be transferred out of said housing via another of said plurality of optical fibers, said housing providing a hermetically sealed enclosure of said plurality of ports.

View all claims
  • 10 Assignments
Timeline View
Assignment View
    ×
    ×