Flip chip mounting technique

• US 6,189,208 B1
• Filed: 08/23/1999
• Issued: 02/20/2001
• Est. Priority Date: 09/11/1998
• Status: Expired due to Fees

• Current Assignee: Epoxy Technology, Inc. (Meridian Adhesives Group LLC), Toray Engineering Company Limited (Toray Industries Incorporated)
• Original Assignee: Polymer Flip Chip Corporation, Toray Engineering Company Limited (Toray Industries Incorporated)
• Inventors: Wada, Minoru, Mori, Toshihiro, Ito, Koji, Akita, Masanori, Estes, Richard H.
• Primary Examiner(s): Gerrity, Stephen F.
• Assistant Examiner(s): Kim, Paul D.
• Application Number:
  US09/378,847
• Time in Patent Office: 547 Days
• Field of Search: 297/40, 298/32, 298/40, 174/260
• US Class Current: 29/840
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05664 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83856 Pre-cured adhesive, i.e. B-stage adhesive
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01052 : Tellurium [Te]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01084 : Polonium [Po]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/53178 : Chip component

Abstract

The invention provides a flip chip mounting process in which a layer of electrically insulating adhesive paste is applied on a substrate having bond pads, covering the bond pads with the adhesive. Electrically conductive polymer bumps are formed on bond pads of a flip chip to be bonded to the substrate, and the polymer bumps are at least partially hardened. The bond pads of the flip chip are then aligned with the bond pads of the substrate, and the at least partially hardened polymer bumps are pushed through the adhesive on the substrate to contact directly and bond the polymer bumps to the bond pads of the substrate. This process results in direct electrical and mechanical bonding of the polymer bumps between the chip and substrate bond pads, even though the adhesive film was applied on the substrate in a manner that covered the substrate bond pads. The polymer bumps displace the adhesive as they are pushed through it and expand laterally on the substrate bond pads. As a result, the area around the polymer bumps between the chip and the substrate is filled with the adhesive, in the manner of an underfill, whereby a separate, post-bond underfill process is not required.

Claims

1. A method for mounting a flip chip on a substrate, comprising the steps of:

applying a layer of electrically insulating adhesive paste on a substrate having bond pads, covering the bond pads with the adhesive;

forming electrically conductive polymer bumps on bond pads of a flip chip;

at least partially hardening the polymer bumps;

aligning the bond pads of the flip chip with the bond pads of the substrate;

pushing the at least partially hardened polymer bumps through the adhesive on the substrate to contact directly and bond the polymer bumps to the bond pads of the substrate.

2. The method of claim 1 further comprising a step of at least partially drying the adhesive paste applied to the substrate before the step of pushing the polymer bumps through the adhesive on the substrate.

3. The method of claim 1 wherein the step of at least partially hardening the polymer bumps comprises at least partially drying the polymer bumps.

4. The method of claim 1 wherein the step of at least partially hardening the polymer bumps comprises at least partially polymerizing the polymer bumps.

5. The method of claim 1 wherein the step of pushing the polymer bumps through the adhesive on the substrate further comprises applying heat to the flip chip as the bumps are pushed through the adhesive.

6. The method of claim 1 further comprising a step of applying heat to the flip chip after the polymer bumps contact the bond pads of the substrate.

7. The method of claim 1 wherein the step of pushing the polymer bumps through the adhesive on the substrate comprises applying pressure to the flip chip for a duration selected, based on material characteristics of the adhesive and of the polymer bumps, that vertically compresses the bumps between the flip chip and the substrate to a compressed height that is less than bump height as-formed.

8. The method of claim 7 wherein the compressed bump height is less than about 80% of bump height as-formed.

9. The method of claim 1 wherein the step of forming polymer bumps comprises forming polymer bumps each having a bump height that is greater than adhesive paste thickness as-applied on the substrate.

10. The method of claim 9 wherein the bump height is at least about 25% greater than adhesive paste thickness.

11. The method of claim 1 wherein the polymer bumps are formed of a thermoplastic material.

12. The method of claim 1 wherein the polymer bumps are formed of a thermoset material.

13. The method of claim 1 wherein the polymer bumps are formed of a B-stage thermoset material.

14. The method of claim 1 wherein the step of forming polymer bumps comprises stenciling polymer bumps.

15. The method of claim 1 wherein the step of forming polymer bumps comprises screen printing polymer bumps.

16. The method of claim 1 wherein the applied layer of insulating adhesive paste comprises a thermoplastic.

17. The method of claim 1 wherein the applied layer of insulating adhesive paste comprises a thermoset.

18. The method of claim 1 wherein the applied layer of insulating adhesive paste comprises a B-stage thermoset.

19. The method of claim 1 wherein the applied layer of insulating adhesive paste includes a solvent.

20. The method of claim 1 wherein the step of applying the adhesive paste to the substrate comprises stenciling the adhesive paste on the substrate.

21. The method of claim 1 wherein the step of applying the adhesive paste to the substrate comprises screen printing the adhesive paste on the substrate.

22. The method of claim 1 wherein the step of applying the adhesive paste to the substrate comprises dispensing the adhesive paste on the substrate.

23. The method of claim 1 wherein the step of applying the adhesive paste to the substrate comprises spin-coating the adhesive paste on the substrate.

24. The method of claim 1 wherein the formed polymer bumps include hard particles.

25. The method of claim 1 wherein the formed polymer bumps include particles having jagged edges and wherein edges of included particles protrude from bump surfaces.

26. The method of claim 25 wherein the particles included in the polymer bumps are electrically nonconductive.

27. The method of claim 25 wherein the particles included in the polymer bumps are electrically conductive.