Method for manufacturing cooling unit comprising heat pipes and cooling unit

• US 6,189,213 B1
• Filed: 07/16/1999
• Issued: 02/20/2001
• Est. Priority Date: 11/15/1996
• Status: Expired due to Term

• Current Assignee: Furukawa Electric Company Limited
• Original Assignee: Furukawa Electric Company Limited
• Inventors: Tanaka, Suemi, Yamamoto, Masaaki, Kimura, Yuichi
• Primary Examiner(s): ROSENBAUM, IRENE CUDA
• Application Number:
  US09/356,180
• Time in Patent Office: 585 Days
• Field of Search: 29/800.3, 298/900.38, 298/900.35, 165/80.3
• US Class Current: 29/890.035
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 2275/02 by using bonding materials brazing F28F2275/04; by embedding elements in particular materials
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making
• CPC Class Codes: Y10T 29/49359 Cooling apparatus making, e.g., air conditioner, refrigerator
• CPC Class Codes: Y10T 29/49913 by constricting outer annulus

Abstract

The present invention relates to a cooling unit for electronic devices wherein the manufacturing method comprises the steps of: (a) preparing a plate-type metal block for removing heat generated from an electronic component, the metal block having holes in the thickness part of the metal block and having convex portions formed on one main surface or both main surfaces of the metal block; (b) inserting heat pipes into the holes; and (c) applying a local and two-dimensional force from the surface of the metal block to the convex portions to make the surface flat bringing the outer surface of each heat pipe into close contact with the inner wall of each hole in the metal block.

Claims

1. A cooling unit manufacturing method comprising the steps of:

(a) preparing a substantially plate-type metal block for removing heat generated from an electronic component, said metal block having a U-shaped groove provided with a protruding portion from at least one main surface or both main surfaces of the metal block;

(b) inserting a heat pipe into said U-shaped groove for removing heat of the metal block; and

(c) applying local and two-dimensional force from the surface of the metal block to the protruding portion to make the surface substantially flat and bringing each heat pipe into close contact with the inner wall of each U-shaped groove in the metal block.

2. A cooling unit manufacturing method according to claim 1, wherein said U-shaped groove into which the heat pipe is inserted has a substantially circular cross section and the heat pipe has a substantially circular cross section.

3. A cooling unit manufacturing method according to claim 1, wherein a convex portion is further formed on the other main surface of the metal block at a location that corresponds to where the U-shaped groove having the protruding portion is provided on the main surface.

4. A cooling unit manufacturing method according to claim 1, wherein said convex portion formed on the other main surface, to which the U-shaped groove having the protruding portion correspond, has a substantially trapezoidal shape.

5. A cooling unit manufacturing method according to claim 1, wherein said metal block is made of one of aluminum and aluminum alloy.

6. A cooling unit comprising the metal block and the heat pipe which is produced by the manufacturing method defined in claim 1.