Heat sink with a heat pipe for spreading of heat

• US 6,189,601 B1
• Filed: 05/05/1999
• Issued: 02/20/2001
• Est. Priority Date: 05/05/1999
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chiu, Chai-Pin, Goodman, Lloyd Jack, Watwe, Abhay W., Viswanath, Ram
• Primary Examiner(s): Lazarus, Ira S.
• Assistant Examiner(s): DUONG, THO V
• Application Number:
  US09/305,847
• Time in Patent Office: 657 Days
• Field of Search: 165/80.3, 165/104.33, 165/185, 361/700, 257/715, 174/15.2
• US Class Current: 165/80.3
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 1/22 the means having portions engaging further tubular elements
• CPC Class Codes: F28F 2215/10 Secondary fins, e.g. projections or recesses on main fins
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention provides a heat sink for cooling and electronic device. The heat sink includes a member, and a heat pipe secured to the member. The member has a first portion, a second portion, and a plurality of fins on the second portion. The heat pipe has a first, evaporator section and a second, condenser section. The first section is located at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device. The second section is located at the second portion so that heat can be transferred therefrom to the second portion.

Claims

1. A heat sink for cooling an electronic device, which includes:

a member having a first portion, a second portion and a plurality of fins on the second portion and the fins extending in at least two different directions from the second portion; and

a heat pipe secured to the member, the heat pipe having a first, evaporator section at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device, and a second, condenser section at the second portion so that heat can be transferred therefrom to the second portion, the heat pipe changing direction at least once between the first section and the second section.

2. A heat sink according to claim 1 wherein the first portion is a first heat plate portion in a first plane, and the second portion is a second heat plate portion in a second plane which is different to the first plane.

3. A heat sink according to claim 2 wherein the first and second heat plate portions are substantially parallel to one another.

4. A heat sink according to claim 1 wherein the member has a third portion and a plurality of fins on the third portion and the heat pipe includes a third section between the first and second sections, the third section being located at the third portion so that heat can be transferred therefrom to the third portion, wherein the heat pipe changes direction at least once between the first and third portions, and at least once more between the third and second portions.

5. A heat sink according to claim 1 wherein the second portion is a heat plate portion and the fins are located in one set on one side of the heat plate portion, and in another set on an opposing side of the heat plate portion.

6. A heat sink according to claim 1 wherein the first section has one surface, through which heat can be transferred thereto from the electronic device, which is exposed, and an opposing surface against the first portion.

7. A heat sink according to claim 1 wherein the second section is located within the second portion.

8. A heat sink according to claim 7 wherein an interface between the second portion and the second section is at least a transition fit.

9. A heat sink according to claim 1 wherein the heat pipe is a flat heat pipe.

10. A heat sink according to claim 9 wherein the heat pipe has a thickness, a length which changes direction, the length and the thickness being in an x-y plane, and a width in a z-direction.

11. A heat sink according to claim 1 wherein each fin has a length and a thickness, the length being less than fifteen times the thickness.

12. A heat sink according to claim 11 wherein the member is made of aluminum.

13. A heat sink according to claim 1 wherein the member includes a third portion, and a plurality of fins on the third portion, and the heat pipe includes a third section on a side of the first section opposing the second section, the third section being at the third portion so that heat can be transferred therefrom to the third portion, the heat pipe changing direction at least once between the first section and the third section.

14. A heat sink according to claim 13 wherein the second and third portions are heat plate portions located in substantially the same plane.

15. A heat sink according to claim 14 wherein the fins on the second portion are located in one set on one side of the second portion and in another set on an opposing side of the second portion, and the fins on the third portion are located in one set on one side of the third portion and in another set on an opposing side of the third portion.

16. A heat sink for cooling an electronic device, which includes:

a member having a first plate portion in a first plane, a second plate portion in a second plane which is different to the first plane, and a plurality of fins on the second plate portion and the fins extending in at least two different directions from the second portion; and

a heat pipe secured to the member, the heat pipe having a first, evaporator section against the first plate portion so that heat can be transferred thereto from a heat generating component of the electronic device, and a second, condenser section against the second plate portion so that heat can be transferred therefrom to the second plate portion, the heat pipe changing direction at least once between the first section and the second section.

17. An assembly which includes:

an electronic device having a heat generating component;

a member mounted to the electronic device over the components, the member having a first portion and a second portion located distant from the component, and a plurality of fins on the second portion the fins and extending in at least two different directions from the second portion; and

a heat pipe secured to the member, the heat pipe having a first, evaporator section at the component so that heat can be transferred from the component to the first section, and a second condenser section at the second portion so that heat can be transferred from the second section to the insert portion, the heat pipe changing direction at least once between the first section and the second section.