Gas treatment apparatus

• US 6,190,459 B1
• Filed: 12/15/1998
• Issued: 02/20/2001
• Est. Priority Date: 01/07/1998
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Nagashima, Shinji, Takeshita, Kazuhiro, Katayama, Kyoshige, Mizutani, Yoji
• Primary Examiner(s): Lund, Jeffrie R.
• Application Number:
  US09/210,854
• Time in Patent Office: 798 Days
• Field of Search: 118/715, 156/345
• US Class Current: 118/715
• CPC Class Codes: B05D 1/005 Spin coating
• CPC Class Codes: B05D 3/0453 After-treatment
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence

Abstract

A gas flow regulating surface portion 37a is the farthest from the front surface of a wafer W in the middle between a peripheral portion of the wafer W and a center portion of a sealing vessel. The gas flow regulating portion 37a protrudes to the front surface of the wafer W in the vicinity of a center portion that surrounds an exhausting opening 35a. In other words, a convex portion 37c is formed in a peripheral area of the gas flow regulating surface portion 37a that surrounds the exhausting opening 35a. Since treatment gas flows along the front surface of the gas flow regulating portion 37a, treatment gas equally contacts the wafer W in the radius direction of the wafer W. Thus, a film with equal thickness is formed.

Claims

1. A gas treatment apparatus, comprising:

a sealing vessel for treating a substrate with gas;

a substrate holding portion, disposed in said sealing vessel, for holding the substrate;

a gas flow regulating surface portion, disposed opposite to a treatment surface of the substrate held on said substrate holding portion, said gas flow regulating surface portion protruding to said substrate holding portion and having at least an outer peripheral portion for forming a narrowed gas path with said substrate holding portion;

a gas supplying opening disposed along a peripheral portion of said gas flow regulating surface portion; and

an exhausting opening facing the treatment surface of the substrate held on said substrate holding portion and disposed at a center portion of said sealing vessel.

2. The gas treatment apparatus as set forth in claim 1, further comprising:

a buffer chamber disposed outside the outer peripheral portion and at an upper portion of said gas supplying opening.

3. The gas treatment apparatus as set forth in claim 2,

wherein an inner periphery of said gas flow regulating surface portion is composed of:

a first concave portion formed in almost a spherical surface shape;

a convex portion formed inside the first concave portion and protruding in an almost doughnut shape; and

a second concave portion formed in an almost circular cone shape inside the convex portion and connected to said exhausting opening, and

wherein the first concave portion, the convex portion, and the second concave portion are inwardly and continuously formed on concentric circles.

4. The gas treatment apparatus as set forth in claim 2,

wherein an almost spherical surface shaped concave portion is formed on an inner periphery of said gas flow regulating surface portion.

5. The gas treatment apparatus as set forth in claim 2,

wherein said outer peripheral portion forms a partitioning portion with a cylindrical section, and

wherein an inner periphery of said gas flow regulating surface portion is a plane with almost the same height as a vertex portion of the buffer chamber.

6. A The gas treatment apparatus as set forth in claim 1,

wherein the outer peripheral portion is a partition plate that partitions an inner space of said sealing vessel into a cylindrical space facing the treatment surface of the substrate held on said substrate holding portion and a buffer chamber formed outside the cylindrical space, and

wherein an inner periphery of said gas flow regulating surface portion is composed of:

an outer portion formed in an almost plane shape;

an inclined portion formed inside the outer portion, the inclined portion forming a side surface of an almost circularly cone shaped protrusion portion;

a convex portion formed in an almost doughnut shape inside the inclined portion; and

a concave portion formed in an almost circularly cone shape inside the convex portion and connected to said exhausting opening, and

wherein the outer portion, the inclined portion, and the convex portion, and the concave portion are inwardly and continuously formed on concentric circles.

7. The gas treatment apparatus as set forth in claim 1,

wherein a circularly cone shaped concave portion with a vertex of said exhausting opening is formed on an inner periphery of said gas flow regulating surface portion.

8. The gas treatment apparatus as set forth in claim 1,

wherein an inner periphery of said gas flow regulating surface portion is composed of:

a first concave portion formed in almost a spherical surface shape;

a convex portion formed inside the first concave portion and protruding in an almost doughnut shape; and

a second concave portion formed in an almost circular cone shape inside the convex portion and connected to said exhausting opening, and

wherein the first concave portion, the convex portion, and the second concave portion are inwardly and continuously formed on concentric circles.

9. The gas treatment apparatus as set forth in claim 1,

wherein said gas supplying opening is formed in a slit shape along a peripheral direction of said sealing vessel.

10. The gas treatment apparatus as set forth in claim 1,

wherein said sealing vessel is composed of:

a first member on which said substrate holding portion is disposed; and

a second member on which said gas flow regulating surface portion is disposed, the second member being approachable to the first member.

11. The gas treatment apparatus as set forth in claim 10,

wherein said gas supplying path is formed through the first member.

12. The gas treatment apparatus as set forth in claim 1,

wherein a coating solution of which particles or colloid of a start substance of a film component is dispersed to solvent is coated as a coated film on the substrate, and

wherein gas for accelerating gelatinizing the particles or colloid of the coated film is supplied to said sealing vessel.

13. The gas treatment apparatus as set forth in claim 12,

wherein the gas is alkaline gas.