Semiconductor micromachine and manufacturing method thereof
First Claim
1. A manufacturing method of a semiconductor micromachine having a substrate, a movable portion arranged opposite said substrate with a gap interposed therebetween, said movable portion comprising a semiconductor having a plurality of electrode sections and an electrical insulation section interconnecting the electrode sections, and supporting bodies which floatably support said movable portion, comprising the steps of:
- forming an etching layer on said substrate;
forming a diffusion inhibiting layer on said etching layer;
forming a semiconductor layer on said diffusion inhibiting layer;
selectively doping said semiconductor layer with a dopant;
patterning said semiconductor layer by photolithographic etching to form holes for introducing an etchant, said plurality of electrode sections, said electrical insulation section, and said supporting bodies; and
forming said gap and said semiconductor layer as the movable portion by removing said etching layer using said etchant.
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Accused Products
Abstract
A semiconductor micromachine and method of making the micromachine, wherein the micromachine includes a substrate and a movable portion made of a semiconductor thin film. The movable portion is arranged opposite the substrate with a gap interposed therebetween, and is supported by acicular bodies. This movable portion is provided with electrode sections, wires and an electrical insulation section interconnecting the electrode sections and the wires. The electrical insulation section prevents crosstalk of signals among the electrode sections and the wires to achieve a high S/N ratio as well as a high degree of design freedom. In order to achieve this purpose, the semiconductor micromachine of the present invention includes.
34 Citations
18 Claims
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1. A manufacturing method of a semiconductor micromachine having a substrate, a movable portion arranged opposite said substrate with a gap interposed therebetween, said movable portion comprising a semiconductor having a plurality of electrode sections and an electrical insulation section interconnecting the electrode sections, and supporting bodies which floatably support said movable portion, comprising the steps of:
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forming an etching layer on said substrate;
forming a diffusion inhibiting layer on said etching layer;
forming a semiconductor layer on said diffusion inhibiting layer;
selectively doping said semiconductor layer with a dopant;
patterning said semiconductor layer by photolithographic etching to form holes for introducing an etchant, said plurality of electrode sections, said electrical insulation section, and said supporting bodies; and
forming said gap and said semiconductor layer as the movable portion by removing said etching layer using said etchant. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A manufacturing method of a semiconductor micromachine having a substrate, a movable portion arranged opposite said substrate with a gap interposed therebetween, said movable portion comprising a semiconductor and having a plurality of electrode sections and an electrical insulation section interconnecting the electrode sections, and supporting bodies which floatably support said movable portion, comprising the steps of:
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forming an etching layer comprising one of a Ge thin film and a Si—
Ge mixed crystal thin film on said substrate;
forming a semiconductor layer comprising at least one element of the fourth group of elements in the periodic table on said etching layer;
selectively doping said semiconductor layer with a dopant;
patterning said semiconductor layer by photolithographic etching to form holes for introducing an etchant, said plurality of electrode sections, said electrical insulation section, and said supporting bodies; and
forming said gap and said semiconductor layer as the movable portion by removing said etching layer using said etchant. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification