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Method and apparatus for detecting optimal endpoints in plasma etch processes

  • US 6,190,927 B1
  • Filed: 10/27/1997
  • Issued: 02/20/2001
  • Est. Priority Date: 06/30/1995
  • Status: Expired due to Term
First Claim
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1. A method of detecting an endpoint for terminating a process, said method comprising the steps of:

  • defining the endpoint in the form of a mode, a minimum value of a delay count, and a threshold;

    producing a set of samples;

    processing the samples;

    incrementing the delay count when the threshold has been exceeded by a predefined number and the mode is met, otherwise setting the delay count equal to zero;

    repeating said processing step for each set of samples until the delay count reaches or exceeds the minimum value; and

    terminating the process when the delay count reaches or exceeds the minimum value.

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